Development of High-Speed Non-Contact Removal Processing Technology of the Brittle Material by Crack Propagation used Shear Stress by Laser
Development of High-Speed Non-Contact Removal Processing Technology of the Brittle Material by Crack Propagation used Shear Stress by Laser
批准号:
23560884
负责人:
MORITA Hidetoshi
金额:
$3.41万
依托单位国家:
日本
项目类别:
Grant-in-Aid for Scientific Research (C)
财政年份:
2011
资助国家:
日本
项目状态:
已结题
起止时间:
2011 至 2013
中文摘要
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英文摘要
Now, glass has been used for various industrial products. Industrial fileds call for more efficiency processing method than the conventional method, because it is expected that its materials are used more in the future. Currently glass is processed by grinding wheel. In this method, however, chipping and crack are likely to occur since glass is a hard brittle material. So, there is a limit to the production efficiency of grinding wheel. The authors have found out when the laser is radiated to glass, a mirror surface groove on glass is generated. Then the authors research the new removal processing method using this phenomenon. The method enables to process glass without direct contacts, so this method can solve negative points of grinding wheel. And the production efficiency improves because quantity of removal is large. In this paper, the authors summarize the result of the slicing processing experiment, consideration of crack propagation, and the practical processing method.
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DOI:
--
发表时间:
2013
期刊:
影响因子:
--
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DOI:
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2013
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发表时间:
2013
期刊:
影响因子:
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[村山理一,浦頭 豊,澁田賢司, 北村勇樹,鈴木理史,浅田格,熊谷進,渡邊陽一, 永田紀一郎,森田英俊,原要一郎]
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DOI:
--
发表时间:
2012
期刊:
影响因子:
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