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Surface Integrity Characterization of Sapphire Wafers for Wireless and Fibre Optic Semiconductor Industry

Surface Integrity Characterization of Sapphire Wafers for Wireless and Fibre Optic Semiconductor Industry
用于无线和光纤半导体行业的蓝宝石晶圆的表面完整性表征
批准号:
LP0346966
负责人:
Prof Liangchi Zhang
金额:
$19.28万
依托单位:
依托单位国家:
澳大利亚
项目类别:
Linkage Projects
财政年份:
2003
资助国家:
澳大利亚
项目状态:
已结题
起止时间:
2003-12-01 至 2007-11-30

项目摘要

项目成果

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中文摘要
翻译
本项目旨在揭示蓝宝石晶片表面完整性的机制,从而建立其与集成电路质量加工的关系。该项目将表面损伤、残余应力、热冲击和位错演化作为一个有机整体综合考虑,为当前生产实践中的问题提供有效的解决方案。由不令人满意的表面完整性引起的问题代表了无线和光纤半导体工业的主要支出。所提出的研究持有非常真实的可能性,降低资本成本和提高高容量集成电路的质量。
英文摘要
This project aims to uncover the mechanism of surface integrity in sapphire wafers and thus to establish its relationship with the quality processing of integrated circuits. The project will comprehensively consider surface damage, residual stresses, thermal shock and dislocation evolution as an organic whole to provide an effective solution to the problems in the current production practice. Problems caused by unsatisfactory surface integrity represent a major outlay for the wireless and fibre optic semiconductor industry. The proposed research holds the very real possibility of reducing the capital cost and enhancing the quality of the integrated circuits of high capacity.
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