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Surface Integrity Characterization of Sapphire Wafers for Wireless and Fibre Optic Semiconductor Industry

Surface Integrity Characterization of Sapphire Wafers for Wireless and Fibre Optic Semiconductor Industry
用于无线和光纤半导体行业的蓝宝石晶圆的表面完整性表征
批准号：
LP0346966
负责人：
Prof Liangchi Zhang
金额：
$19.28万
依托单位：
The University of Sydney
依托单位国家：
澳大利亚
项目类别：
Linkage Projects
财政年份：
2003
资助国家：
澳大利亚
项目状态：
已结题
起止时间：
2003-12-01 至 2007-11-30
来源：
https://dataportal.arc.gov.au/RGS/Web/Grants/LP0346966
关键词：
SurfaceIntegrityCharacterizationSapphireWafers

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中文摘要
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英文摘要
This project aims to uncover the mechanism of surface integrity in sapphire wafers and thus to establish its relationship with the quality processing of integrated circuits. The project will comprehensively consider surface damage, residual stresses, thermal shock and dislocation evolution as an organic whole to provide an effective solution to the problems in the current production practice. Problems caused by unsatisfactory surface integrity represent a major outlay for the wireless and fibre optic semiconductor industry. The proposed research holds the very real possibility of reducing the capital cost and enhancing the quality of the integrated circuits of high capacity.
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