Damage-Free Surfacing of Large Brittle Wafers with On-Machine Flatness Control

通过机上平整度控制对大型脆性晶圆进行无损伤堆焊

• 批准号: DP0773123
• 负责人: Prof Liangchi Zhang
• 金额: $ 84.83万
• 依托单位: The University of New South Wales
• 依托单位国家: 澳大利亚
• 项目类别: Discovery Projects
• 财政年份: 2007
• 资助国家: 澳大利亚
• 起止时间: 2007-02-01 至 2012-01-31
• 项目状态: 已结题
• 来源: https://dataportal.arc.gov.au/RGS/Web/Grants/DP0773123
• 关键词: Damage; Free; Surfacing; Large; Brittle

The knowledge gained from this research project will be of great value to the development of new generations of high-integrity semiconductor systems for high-speed telecommunication, large-scale computation, transport, biomedicine, agriculture, mining and security. The outcomes will have significant impact on the ultra-precision discipline scientifically and will sharpen the competitive edge of the Australian fabrication industry. The research will open up remarkable opportunities for young researchers to work in one of the most frontier fields in the 21st century.

从这项研究项目中获得的知识将对开发用于高速电信、大规模计算、运输、生物医学、农业、采矿和安全的新一代高集成度半导体系统具有重要价值。这一结果将对科学上的超精密学科产生重大影响，并将增强澳大利亚制造业的竞争优势。这项研究将为年轻的研究人员提供在21世纪最前沿的领域之一工作的绝佳机会。