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Evaluation of Mechanical Properties of Thin film Structure by UsingMEMS Technology

Evaluation of Mechanical Properties of Thin film Structure by UsingMEMS Technology
利用MEMS技术评估薄膜结构的机械性能
批准号:
23760103
负责人:
ANDO Taeko
金额:
$2.91万
依托单位:
依托单位国家:
日本
项目类别:
Grant-in-Aid for Young Scientists (B)
财政年份:
2011
资助国家:
日本
项目状态:
已结题
起止时间:
2011 至 2012

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中文摘要
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英文摘要
The objective of this study is to reveal the factor influencing the fracture property of single crystal silicon in micro- and nano-scale. We have developed the tensile testing device for dealing with microscale samples. Concentration of impurities (B and Ge) in three testing material were different from each other. Measured Young’s modulus and fracture strength decreased with increasing the impurities concentration.
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Dependence of Mechanical on Position in Silicon Ingot by Evaluating B and Ge Codoped Silicon
通过评估 B 和 Ge 共掺杂硅来评估机械对硅锭中位置的依赖性
DOI: --
发表时间: 2013
期刊:
影响因子: --
作者: [D. Yamashita, M. Noda, K. Funami, 田中展,渋谷陽二,泉聡志,酒井信介, T. Shirata]
通讯作者: T. Shirata
DOI: --
发表时间: 2013
期刊:
影响因子: --
作者: [Hama, T.,Seto, Y., Tanaka, M., Kusano, H., Hirano, Y., Aoki, Y., Saito, H., Kimpara, I., 白田竜也]
通讯作者: 白田竜也
Evaluation of physical properties of nano-scale structures by combination of MEMS and in-situ TEM observation
  • 批准号:
    16H03819
  • 项目类别:
    Grant-in-Aid for Scientific Research (B)
  • 资助金额:
    $12.48万
  • 财政年份:
    2016
  • 负责人:
    ANDO Taeko
  • 依托单位:
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