Improvement of strength and conductivity for Cu-Ti alloys aged in a hydrogen atmosphere

氢气氛中时效铜钛合金强度和电导率的提高

• 批准号: 23686104
• 负责人: SEMBOSHI Satoshi
• 金额: $ 6.74万
• 依托单位: Tohoku University
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for Young Scientists (A)
• 财政年份: 2011
• 资助国家: 日本
• 起止时间: 2011-11-18 至 2014-03-31
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-23686104/
• 关键词: 組織制御; 銅合金; 水素; 相変態; 時効析出; 力学特性; 電気伝導性; 構造評価; 導電率; 強度; 透過型電子顕微鏡; X線回折; 導電性材料; 抽出分離; 状態図

We attempted to prepare Cu-Ti based alloys with a high strength and a high electrical conductivity by hydrogenation procedures. The electrical conductivity of Cu-Ti alloys was significantly improved without degradation of the mechanical properties by aging in a hydrogen atmosphere. The strengthening was primarily due to fine dispersion of needle-shaped Cu4Ti precipitates, which was similar with the case of conventional aging in vacuum. The enhancement of the conductivity was due to a reduction of a concentration of solute Ti in the matrix phase, which was caused by co-precipitation of Cu4Ti and TiH2. The balance of the strength and conductivity was improved by aging under a higher hydrogen pressure at a low temperature. Prior-deformation before aging was also useful to improve the properties. Eventually, we demonstrated that optimizing the thermomechanical process conditions imparted an excellent balance of strength and conductivity, of more than 950 MPa and 25% IACS, respectively.

我们尝试用氢化法制备具有高强度和高导电性的Cu-Ti基合金。Cu-Ti合金在氢气氛中时效后，其导电性能得到显著提高，而力学性能没有降低。强化主要是由于针状Cu 4 Ti析出相的细小弥散，这与常规真空时效的情况相似。导电性的增强是由于基体相中溶质Ti的浓度降低，这是由Cu 4 Ti和TiH 2的共沉淀引起的。在较高的氢压和较低的温度下进行时效处理，可以改善强度和导电性的平衡。时效前的预变形也有利于提高合金的性能。最后，我们证明，优化热机械工艺条件赋予了一个很好的平衡的强度和导电性，分别超过950 MPa和25%IACS。

项目成果

Cu-Ti合金に生ずるスピノーダル分解と時効析出のX線散乱法を用いた解析

X射线散射法分析Cu-Ti合金的旋节线分解和时效析出

• 发表时间: 2011
• 作者: 長谷川啓史;佐藤成男;高橋洋平;千星聡;我妻和明
• 通讯作者: 我妻和明

メゾスコピック組織制御分野

细观组织控制场

Aging of Cu-3 at% Ti Alloys in Hydrogen Atmosphere: Influence of Hydrogen Pressure on Strength and Electrical Conductivity

• DOI: 10.2320/matertrans.d-ma201031
• 发表时间: 2011-04
• 期刊: Materials Transactions
• 影响因子: 1.2
• 作者: S. Semboshi;T. Nishida;H. Numakura

時効析出型Cu-Ti合金における時効熱処理にともなうミクロ構造因子変化

时效沉淀型铜钛合金时效热处理显微组织因素的变化

• 发表时间: 2013
• 作者: 佐藤成男;長谷川啓史;千星聡;我妻和明
• 通讯作者: 我妻和明

時効析出型Cu-Ti合金中析出物の抽出分離

时效沉淀铜钛合金中沉淀物的提取和分离

• 发表时间: 2012
• 作者: 千星聡;石黒三岐雄;佐藤成男;我妻和明;高杉隆幸
• 通讯作者: 高杉隆幸