HI-IMPERATIVE (Highly Innovative Thermally Conductive Materials for Power-Electronics Applications in EV)

汽车电气化正在推动电力电子领域的一场革命，更高的功率密度创造了对增强热管理的“需求”，同时更高的工作电压也需要更好的电绝缘。**项目愿景**是通过开发具有导热性的低成本**热界面材料（TIMs）来解决电力电子挑战。10W/mK，工作温度高达175°C，同时具有电绝缘**。三个高?已经确定了tim，代表了每个关键接口所需的全部属性和工艺方法。* *关键目标:* * 1 \。开发新型TIM材料。开发热固性TIMs：**“3d填充”TIM, ？\>3W/mK**，可用于室温下真空分散或转移成型的芯片，用于50µm间隙的无空隙填充。**TIM板，？\>10W/mK.**c。**符合β -阶段Pre-Preg TIM， ？\>10W/mK**适用于部分固化薄膜，使用标准PCB工艺层压。将TIMs应用于当前MTCL“标准”直接键合铜（DBC）功率MOSFET模块芯片设计（这将构成MTCL未来功率模块的基础），以实现温升=0.1°C/W和最大Tj=175°C **重点领域**是用于电动汽车的新型和现有电力电子产品，二级市场是快速增长的零碳市场，可再生能源市场作为智能电网配电的一部分，并进一步应用于高速数据技术，如5G。HI-IMPERATIVE是一种改变游戏规则的方法，用于开发热固性纳米复合材料，这将导致高性能TIMs的商业化实施。HI-IMPERATIVE在技术性能（非常高的导热性和工作温度，同时具有电绝缘性）和优化的流动性能方面明显领先于其他基于陶瓷和聚合物的TIMs，这将使低成本TIMs的应用首次实现有效的热控制，为电动汽车的大功率电子元件开辟全球市场机会。HI-IMPERATIVE有3个合作伙伴：** *Dycotec材料有限公司（DML）：** SME将制造和商业化混合hBN/ bnnt热固性纳米复合材料；** *Microchip Technology Caldicot Ltd (MTCL)**: Microchip Technology Incorporated的一部分，全球电力电子OEM（2020年收入为5.27亿美元（38.7亿英镑）），将应用于商业电力电子系统的解决方案；** *曼彻斯特大学(UoM)**，世界一流的材料研究机构，将帮助开发和表征材料。

Vehicle electrification is driving a revolution in power-electronics, where higher power densities are creating the **need** for enhanced thermal management in combination with higher operating voltages necessitating superior electrical insulation.**Project vision** is to address the power-electronics challenge by developing, low-cost **Thermal Interface Materials (TIMs) with thermal conductivity, ?\>10W/mK and operating temperatures up to 175°C, whilst being electrically insulative**. Three high-? TIMs have been identified, representing the full range of properties and process approaches required for each critical interface.**Key Objectives:**1\. To develop novel TIM materials2\. To develop thermoset TIMs:a. **"3D-fill" TIM, ?\>3W/mK**, that can be applied to chips using vacuum dispersion or transfer moulding at room temperature for void-free filling of 50µm gaps.b. **TIM sheet, ?\>10W/mK.**c. **Conformable Beta-stage Pre-Preg TIM, ?\>10W/mK** applied as partially cured film to be laminated using standard PCB processes.3\. To implement TIMs to current MTCL "Standard" Direct bonded copper (DBC) power MOSFET module chip design (that will form the basis of MTCL's future power modules) to achieve temperature rise =0.1°C/W and maximum Tj=175°C.**The focus areas** are in new and existing power-electronics for EVs, with secondary markets in rapidly growing markets in zero-carbon, renewable energy markets as a part of smart grid power distribution, with further applications in high-speed data technologies, such as 5G.HI-IMPERATIVE is a **game-changing** approach to develop thermoset nanocomposites that will lead to commercial implementation of high performance TIMs. HI-IMPERATIVE is **significantly ahead of other ceramic and polymer based TIMs, in terms of technical performance (very high thermal conductivity and operating temperature whilst being electrically insulative) and optimised flow properties** that will enable application of low-cost TIMs to achieve effective thermal control for the first time, opening up global market opportunities for high-power-electronic components for EVs.HI-IMPERATIVE has 3 partners:* **Dycotec Materials Limited (DML):** SME that will manufacture and commercialise hybrid hBN/BNNT-thermoset nanocomposites;* **Microchip Technology Caldicot Ltd (MTCL)**: Part of Microchip Technology Incorporated, a global power-electronics OEM ($5.27(£3.87)Bn revenue 2020), that will apply solution to commercial power-electronics systems;* **The University of Manchester (UoM)**, a world-class materials research institute, that will help develop and characterise the materials.