HI-IMPERATIVE (Highly Innovative Thermally Conductive Materials for Power-Electronics Applications in EV)

汽车电动化正在推动电力电子革命，更高的功率密度创造了加强热管理的**需求**，同时更高的工作电压需要更好的电气绝缘。**项目愿景**是通过开发低成本的**热接口材料(TIMS)来应对电力电子挑战，热接口材料具有导热系数？\&10W/MK，工作温度高达175°C，同时具有电绝缘**。三个高-？已经确定了TIM，代表了每个关键接口所需的全部性质和工艺方法。**主要目标：**1\。开发新型的TiM材料。为了开发热固性TIM：a.**“3D-Fill”TIM，？\&gt；3W/MK**，可应用于在室温下使用真空分散或转移模塑的芯片，以实现50微米间隙的无空隙填充。**TIM Sheet，？\&gt；10W/MK.**c.**符合Beta-Stage Pre-Preg TIM，？\&gt；10W/MK**用作部分固化的薄膜，使用标准的印刷电路板工艺进行层压。3\。为了使TIM符合目前MTCL的“标准”直接键合铜(DBC)功率MOSFET模块芯片设计(这将成为MTCL未来电源模块的基础)，以实现温升为0.1°C/W，最大TJ=175°C。**重点领域**是电动汽车的新的和现有的电力电子产品，作为智能电网配电的一部分，在快速增长的市场的二级市场，零碳，可再生能源市场，以及在高速数据技术，如5G的进一步应用。HI-PERFORCED是开发热固性纳米复合材料的**游戏改变**方法，将导致高性能TIM的商业实施。在技术性能(非常高的导热系数和工作温度，同时具有电绝缘)和优化的流动特性方面，HI-PERMANCE在技术性能(非常高的导热系数和工作温度，同时具有电绝缘)和优化的流动特性方面**显著领先于**，这将使低成本TIM的应用首次实现有效的热控制，为电动汽车的高功率电子元件打开全球市场机会。HI-PERVAL有3个合作伙伴：*Dycotec材料有限公司(DML)：**将制造和商业化混合hBN/BNNT-热固性纳米复合材料的SME；*微芯片技术有限公司(MTCL)**：微芯片技术公司的一部分，全球电力电子OEM(5.27(GB 3.87)Bn收入2020)，将应用解决方案，商业电力电子系统；*曼彻斯特大学(UOM)**，世界级材料研究机构，将帮助开发和表征材料。

Vehicle electrification is driving a revolution in power-electronics, where higher power densities are creating the **need** for enhanced thermal management in combination with higher operating voltages necessitating superior electrical insulation.**Project vision** is to address the power-electronics challenge by developing, low-cost **Thermal Interface Materials (TIMs) with thermal conductivity, ?\>10W/mK and operating temperatures up to 175°C, whilst being electrically insulative**. Three high-? TIMs have been identified, representing the full range of properties and process approaches required for each critical interface.**Key Objectives:**1\. To develop novel TIM materials2\. To develop thermoset TIMs:a. **"3D-fill" TIM, ?\>3W/mK**, that can be applied to chips using vacuum dispersion or transfer moulding at room temperature for void-free filling of 50µm gaps.b. **TIM sheet, ?\>10W/mK.**c. **Conformable Beta-stage Pre-Preg TIM, ?\>10W/mK** applied as partially cured film to be laminated using standard PCB processes.3\. To implement TIMs to current MTCL "Standard" Direct bonded copper (DBC) power MOSFET module chip design (that will form the basis of MTCL's future power modules) to achieve temperature rise =0.1°C/W and maximum Tj=175°C.**The focus areas** are in new and existing power-electronics for EVs, with secondary markets in rapidly growing markets in zero-carbon, renewable energy markets as a part of smart grid power distribution, with further applications in high-speed data technologies, such as 5G.HI-IMPERATIVE is a **game-changing** approach to develop thermoset nanocomposites that will lead to commercial implementation of high performance TIMs. HI-IMPERATIVE is **significantly ahead of other ceramic and polymer based TIMs, in terms of technical performance (very high thermal conductivity and operating temperature whilst being electrically insulative) and optimised flow properties** that will enable application of low-cost TIMs to achieve effective thermal control for the first time, opening up global market opportunities for high-power-electronic components for EVs.HI-IMPERATIVE has 3 partners:* **Dycotec Materials Limited (DML):** SME that will manufacture and commercialise hybrid hBN/BNNT-thermoset nanocomposites;* **Microchip Technology Caldicot Ltd (MTCL)**: Part of Microchip Technology Incorporated, a global power-electronics OEM ($5.27(£3.87)Bn revenue 2020), that will apply solution to commercial power-electronics systems;* **The University of Manchester (UoM)**, a world-class materials research institute, that will help develop and characterise the materials.