HI-IMPERATIVE (Highly Innovative Thermally Conductive Materials for Power-Electronics Applications in EV)

汽车电气化正在推动电力电子领域的一场革命，更高的功率密度带来了对增强热管理的 ** 需求 **，而更高的工作电压则需要上级电气绝缘。**项目愿景 ** 是通过开发低成本 ** 导热性好的热界面材料（TIM）来解决电力电子的挑战。10 W/mK，工作温度高达175°C，同时具有电绝缘性 **。三个高-？TIM已被确定，代表了每个关键界面所需的全部特性和工艺方法。**主要目标：**1\.开发新型TIM材料2\。为了开发热固性TIM：a. **“3D填充”TIM，？\> 3 W/mK**，可在室温下使用真空分散或传递模塑法应用于芯片，以实现50µm间隙的无空隙填充。**TIM表，？\> 10W/mK.** C. ** 适形β-阶段预浸TIM，？\> 10 W/mK** 作为部分固化的膜使用标准PCB工艺进行层压。根据当前MTCL“标准”直接键合铜（DBC）功率MOSFET模块芯片设计（将构成MTCL未来功率模块的基础）实施TIM，以实现温升=0.1°C/W和最大Tj=175°C。**重点领域 ** 是新的和现有的电动汽车电力电子产品，在零碳可再生能源市场的快速增长市场中的二级市场，作为智能电网配电的一部分，进一步应用于高速数据技术，如5G。HI-IMPERATIVE是一种 ** 改变游戏规则 ** 的方法，用于开发热固性纳米复合材料，这将导致高性能TIM的商业实施。在技术性能方面，HI-IMPERATIVE ** 显著领先于其他陶瓷和聚合物基TIM（非常高的导热性和工作温度，同时具有电绝缘性）和优化的流动特性 **，这将使低成本TIM的应用首次实现有效的热控制，HI-IMPERATIVE拥有3个合作伙伴：*Dycotec Materials Limited（DML）：** 将生产和商业化hBN/BNNT-热固性纳米复合材料的中小企业;*Microchip Technology Caldicot Ltd（MTCL）**：Microchip Technology Incorporated的一部分，全球电力电子OEM（2020年收入5.27亿美元），将解决方案应用于商业电力电子系统;* 曼彻斯特大学（UoM）**，一个世界级的材料研究机构，将帮助开发和验证材料。

Vehicle electrification is driving a revolution in power-electronics, where higher power densities are creating the **need** for enhanced thermal management in combination with higher operating voltages necessitating superior electrical insulation.**Project vision** is to address the power-electronics challenge by developing, low-cost **Thermal Interface Materials (TIMs) with thermal conductivity, ?\>10W/mK and operating temperatures up to 175°C, whilst being electrically insulative**. Three high-? TIMs have been identified, representing the full range of properties and process approaches required for each critical interface.**Key Objectives:**1\. To develop novel TIM materials2\. To develop thermoset TIMs:a. **"3D-fill" TIM, ?\>3W/mK**, that can be applied to chips using vacuum dispersion or transfer moulding at room temperature for void-free filling of 50µm gaps.b. **TIM sheet, ?\>10W/mK.**c. **Conformable Beta-stage Pre-Preg TIM, ?\>10W/mK** applied as partially cured film to be laminated using standard PCB processes.3\. To implement TIMs to current MTCL "Standard" Direct bonded copper (DBC) power MOSFET module chip design (that will form the basis of MTCL's future power modules) to achieve temperature rise =0.1°C/W and maximum Tj=175°C.**The focus areas** are in new and existing power-electronics for EVs, with secondary markets in rapidly growing markets in zero-carbon, renewable energy markets as a part of smart grid power distribution, with further applications in high-speed data technologies, such as 5G.HI-IMPERATIVE is a **game-changing** approach to develop thermoset nanocomposites that will lead to commercial implementation of high performance TIMs. HI-IMPERATIVE is **significantly ahead of other ceramic and polymer based TIMs, in terms of technical performance (very high thermal conductivity and operating temperature whilst being electrically insulative) and optimised flow properties** that will enable application of low-cost TIMs to achieve effective thermal control for the first time, opening up global market opportunities for high-power-electronic components for EVs.HI-IMPERATIVE has 3 partners:* **Dycotec Materials Limited (DML):** SME that will manufacture and commercialise hybrid hBN/BNNT-thermoset nanocomposites;* **Microchip Technology Caldicot Ltd (MTCL)**: Part of Microchip Technology Incorporated, a global power-electronics OEM ($5.27(£3.87)Bn revenue 2020), that will apply solution to commercial power-electronics systems;* **The University of Manchester (UoM)**, a world-class materials research institute, that will help develop and characterise the materials.