Detailed Characterisation of Tetrivis Ku-Band Phased Array Tx and Rx RFICs for Low Earth Orbit Satellite (LEOSAT)

用于低地球轨道卫星 (LEOSAT) 的 Tetrivis Ku 波段相控阵 Tx 和 Rx RFIC 的详细表征

• 批准号: 10074232
• 金额: $ 6.37万
• 依托单位: TETRIVIS LTD
• 依托单位国家: 英国
• 项目类别: Grant for R&D
• 财政年份: 2023
• 资助国家: 英国
• 起止时间: 2023 至 无数据
• 项目状态: 已结题
• 来源: https://gtr.ukri.org/projects?ref=10074232
• 关键词: Detailed; Characterisation; Tetrivis; Ku; Band

Vision:Between 2020 and 2021, Tetrivis self-funded the design, verification and limited silicon prototyping/fabrication of two Radio-Frequency Integrated Circuits (RFIC) - the TRV003, a Ku-Band (10.7GHz to 12.75GHz) Phased-Array Receiver (Rx) RFIC integrating four dual-beam and dual-polarised (X+Y) receiver paths on the same die, and the TRV004, a Ku-Band (14GHz to 14.5GHz) Phased-Array Transmitter (Tx) RFIC also integrating four dual-beam and dual-polarised (X+Y) transmitter paths on the same die.Both chips were Wafer-Scale-Packaged with die ball pitch being 171um, a dimension that was extremely challenging for UK PCB vendors to work at. PCB die-attach issues and funding limitations thus prevented us from achieving the next milestone in the project, which was the detailed laboratory characterisation of the two RFIC chips.This project will enable Tetrivis address the die-attach PCB issues, revise RFIC PCB mounting strategy and carry out detailed RF laboratory characterisation of the two RFICs. The RFICs were designed to meet the emerging and ever increasing demand by UK, EU, Asian and American satellite companies for Tx and Rx RFICs for use in their Low-Earth-Orbit Satellite (LEOSAT) Earth-Station Phased-Array Smart Antennas.Key Objectives:- To work with sub-contractor to address PCB die-attach issues and achieve consistent connectivity between RFIC balls and PCB- To work with sub-contractor to machine Heat-Sink for RFICs- To work with sub-contractor to make custom RFIC sockets for multiple RFIC characterisation using the same PCB- To develop the Graphical User Interface software for programming the RFIC internal registers- To procure second-hand RF Equipment to aid RFIC characterisation process- To develop software to aid Automated characterisation of RFICs- To carry out detailed RF characterisation of RFICsInnovation:The capability to simultaneously support Ku-Band and Ka-Band spectra with an agile, low-power, low-area and low-cost RFIC solution is one of the design innovations. Limited Ka-Band support was implemented due to time constraints and will be tested.In addition, the ability of the Rx path of the RFIC design to tolerate a coupled Tx signal of M orders of magnitude higher than the Rx signal being received whilst still delivering unprecedented Carrier-to-Noise-and-Interference-Ratio (C/N+I) is the significant architectural, systematic and circuital design challenge that the RFIC design addresses.Finally, the TRV003 and TRV004 RFIC silicon were implemented in an optimal process technology node which enables high-yielding silicon devices with moderate cost overhead, thus strategically positioning the RFIC devices for future mass production ramp-up and commercialisation.

愿景：在2020年至2021年期间，Tetrivis自筹资金设计、验证和有限硅原型/制造了两款射频集成电路（RFIC）-TRV 003，一款Ku波段（10.7GHz至12.75GHz）相控阵接收器（Rx）RFIC，在同一芯片上集成了四条双波束和双极化（X+Y）接收器路径，以及TRV 004，一款Ku波段（14 GHz至14.5GHz）相控阵发射器（Tx）RFIC，也在同一芯片上集成了四条双波束和双极化（X+Y）发射器路径。这两款芯片均采用晶圆级封装，芯片球间距为171 um，这一尺寸对英国PCB供应商来说极具挑战性。因此，PCB芯片贴装问题和资金限制阻碍了我们实现该项目的下一个里程碑，即对两款RFIC芯片进行详细的实验室表征。该项目将使Tetrivis能够解决芯片贴装PCB问题，修改RFIC PCB安装策略，并对两款RFIC进行详细的RF实验室表征。RFIC旨在满足英国、欧盟、亚洲和美国卫星公司对其低地球轨道卫星（LEOSAT）地面站相控阵智能天线中使用的Tx和Rx RFIC的新兴和不断增长的需求。关键目标：- 与分包商合作解决PCB芯片连接问题，并实现RFIC球和PCB之间的一致连接-与分包商合作加工RFIC散热器-与分包商合作使用同一PCB制作定制RFIC插座，用于多种RFIC特性-开发图形用户界面软件，用于对RFIC内部寄存器进行编程-采购二手RF设备，以帮助RFIC特性化过程-开发软件，以帮助RFIC的自动化特性化-对RFIC进行详细的RF特性化创新：通过灵活、低功耗、低面积和低成本的RFIC解决方案同时支持Ku波段和Ka波段频谱的能力是设计创新之一。由于时间限制，实现了有限的Ka波段支持，并将进行测试。此外，RFIC设计的Rx路径容忍比接收到的Rx信号高M个数量级的耦合Tx信号同时仍提供前所未有的载波噪声干扰比（C/N+I）的能力是RFIC设计解决的重大架构、系统和电路设计挑战。最后，TRV 003和TRV 004 RFIC硅在最佳工艺技术节点中实现，该节点能够以适度的成本开销实现高产量硅器件，从而战略性地定位RFIC器件，以用于未来的大规模生产和商业化。