A PCB Surface Finish for the 21st Century

21 世纪的 PCB 表面处理

• 批准号: 10075488
• 金额: $ 5.78万
• 依托单位: AZURION TECHNOLOGY LIMITED
• 依托单位国家: 英国
• 项目类别: Grant for R&D
• 财政年份: 2023
• 资助国家: 英国
• 起止时间: 2023 至 无数据
• 项目状态: 已结题
• 来源: https://gtr.ukri.org/projects?ref=10075488
• 关键词: PCB; Surface; Finish; 21st; Century

The basic PCB manufacturing process has changed very little in over the years, remaining as a complex series of operations involving photo-imaging, etching, drilling and laminating, using a range of chemicals and large quantities of water as well as producing a large amount of effluent. One of the later operations is to apply a 'surface finish' to the copper contact areas where components will be soldered. This surface finish prevents oxidisation of the copper which, if it occurs, will compromise the solder joint between the PCB substrate and the components and leads to product failure. Some of the chemicals used for surface finishes are toxic such as cyanide, which is used in the gold plating process.An initial attempt was made several years ago to develop a similar coating, but this failed to gain traction in the market for several reasons, principally due to the material containing halides which were being phased out in the electronics sector and also, at the time, there was little real interest in environmental issues such as reducing water consumption.There is a growing pressure on all industries to become more environmentally responsible. Consequently, there has been a renewed interest in a nanocoating method that uses no water and produces no waste. A certain class of halide free materials has been identified as a potential alternative to the original nanocoating and test results to date have been encouraging. Apart from the issue of halides, two other key technical issues were identified with the original coating, which will be addressed in the reformulation.The use of plasma coatings for this application will dramatically reduce the water and energy consumption in PCB manufacturing along with a consequent saving in CO2 emissions. Significant cost savings can be achieved with this new technology.An unusual anisotropic property was observed in the original material, that of z-axis conductivity in which the resistance per nanometre is much lower in one axis than in the other two axes. This is key to the proposed surface finish being able to replace metallic surface finishes and needs to be unaffected by any formulation change.

多年来，基本的PCB制造工艺发生了很少的变化，它是一系列复杂的操作，涉及照片成像，蚀刻，钻孔和层压，并使用一系列化学药品和大量水以及产生大量的废水。后来的操作之一是将“表面饰面”应用于将焊接组件的铜接触区域。这种表面饰面可防止铜的氧化作用，如果出现，该铜会损害PCB基板和组件之间的焊接接头，并导致产品故障。一些用于表面表面处理的化学物质是有毒的，例如氰化物，该化学物质用于黄金镀金过程中。几年前进行了初步尝试，以开发类似的涂层，但这未能在市场上获得类似的涂层，主要是由于几个原因，主要是由于包含卤化物的材料在电子部门中逐渐消失的材料，并且在当时的各个行业中都在逐渐逐渐消失。变得更加环保。因此，人们对不使用水并且不会产生浪费的纳米含量方法引起了人们的兴趣。某种类别的无卤化物材料已被确定为原始纳米色的潜在替代品，迄今为止的测试结果令人鼓舞。除了卤化物问题外，原始涂层还确定了另外两个关键的技术问题，这些问题将在重新制定中解决。在本应用中使用血浆涂料将大大减少PCB制造中的水和能源消耗，并节省CO2排放。通过这项新技术可以节省大量成本。在原始材料中观察到异常的各向异性特性，Z轴电导率的电导率比其他两个轴比其他两个轴低得多的Z轴电导率。这是提议的表面表面表面能够替换金属表面饰面的关键，并且需要不受任何配方更改的影响。