SBIR Phase II: A Novel Electroless Nickel/Immersion Gold (ENIG) Surface Finish for Better Reliability of Electronic Assemblies

SBIR 第二阶段：新型化学镀镍/沉金 (ENIG) 表面处理，可提高电子组件的可靠性

• 批准号: 1739047
• 负责人: Kunal Shah
• 金额: $ 75万
• 依托单位: LiloTree
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2017
• 资助国家: 美国
• 起止时间: 2017-09-01 至 2020-07-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=1739047&HistoricalAwards=false
• 关键词: SBIR; Phase; II; Novel; Electroless

The Small Business Innovation Research (SBIR) Phase II project will scale-up development of eco-friendly, cost-effective novel Electroless Nickel Immersion Gold (ENIG) surface finish with high corrosion resistance and robust solder joints for better reliability of electronic assemblies. Conventional ENIG currently available in the market is prone to black-pad defects (hyper-corrosion related failures) associated with de-wetting of solder. ENIG also suffers from brittle solder joint failures. Due to these reasons, there are field failures and reliability concerns of electronic assemblies - component disconnection which lead to overall malfunction of electronic assemblies. Moreover, most ENIG manufacturers/suppliers provide cyanide-based gold chemistry which has health and ecological hazards. The novel ENIG eliminates black pads- corrosion related issues, achieves robust solder joints and provides improved quality and reliability of electronic assembly. Also, it uses cyanide-free chemistry for immersion gold process making it eco-friendly. This allows manufacturers to consume eco-friendly product while avoiding major field failures and resulting consequences. This new technology would be potential replacement for existing ENIG (with market value roughly about 2-3 billion USD/year). The primary focus of the project is to eliminate black-pad related failures and lead to robust, high quality and reliable solder joints for electronic assemblies. The root cause of black-pad defects has been identified as hyper corrosion activity at gold and nickel-phosphorous interface which involves nickel depletion and an enrichment of phosphorous in localized areas. During Phase I, interfacial engineering approach had been used to successfully eliminate black pads by achieving marked improvement in corrosion resistance. This has led to robust solder joints and elimination of brittle failures. In Phase II, the focus will be to scale-up development, optimize the product/chemistries and carry out further reliability testing. The main goal would be the rapid commercialization of novel ENIG into the market. This will involve development of the chemistries/process parameters for replenishing solution to make it market ready, economical and efficient for customers, further chemical testing for quality compliance (shelf life, quality standards, etc.) as well as reliability testing. Reliability testing will involve real world scenarios and various industry standard based testing including drop and vibration tests and solder ball shear and pull tests at extended thermal exposures.

小企业创新研究（SBIR）第二阶段项目将扩大开发环保，具有成本效益的新型化学镀镍金（ENIG）表面光洁度，具有高耐腐蚀性和坚固的焊点，以提高电子组件的可靠性。目前市场上可用的传统ENIG容易出现与焊料去湿相关的黑焊盘缺陷（与过度腐蚀相关的故障）。ENIG还遭受脆性焊点失效。由于这些原因，存在电子组件的现场故障和可靠性问题-导致电子组件整体故障的部件断开。此外，大多数ENIG制造商/供应商提供具有健康和生态危害的氰化物基金化学品。新型ENIG消除了与黑焊盘腐蚀相关的问题，实现了坚固的焊点，并提高了电子组装的质量和可靠性。此外，它使用无氰化物化学浸金工艺，使其生态友好。这使制造商能够消费环保产品，同时避免重大的现场故障和由此产生的后果。这项新技术将成为现有ENIG的潜在替代品（市场价值约为20 - 30亿美元/年）。该项目的主要重点是消除与黑焊盘相关的故障，并为电子组件提供坚固、高质量和可靠的焊点。黑焊盘缺陷的根本原因已被确定为在金和镍-磷界面处的过度腐蚀活动，其涉及镍耗尽和局部区域中磷的富集。在第一阶段，界面工程方法已被用于成功地消除黑垫，实现显着改善耐腐蚀性。这导致了坚固的焊点和消除脆性故障。在第二阶段，重点将是扩大开发规模，优化产品/化学成分，并进行进一步的可靠性测试。主要目标是将新型ENIG迅速商业化并投入市场。这将涉及开发补充溶液的化学/工艺参数，以使其对客户来说既经济又有效，并进一步进行化学测试以确保质量合规性（保质期、质量标准等）。以及可靠性测试。可靠性测试将涉及真实的世界场景和各种基于行业标准的测试，包括跌落和振动测试以及延长热暴露条件下的焊球剪切和拉伸测试。