Compact Semiconductor Modules Enabling Lighter & More Efficient Trains
Compact Semiconductor Modules Enabling Lighter & More Efficient Trains
批准号:
102878
负责人:
金额:
$90.69万
依托单位国家:
英国
项目类别:
Collaborative R&D
财政年份:
2017
资助国家:
英国
项目状态:
已结题
起止时间:
2017 至 --
中文摘要
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英文摘要
Within this project we will develop a 3.3kV/1.8kA Reverse Conducting IGBT (RC-IGBT) devices to replace separate IGBT and Diode chips currently used in modules for rail transportation, wind power generation and High Voltage Direct Current (HVDC) transmission. Compared with the state-of-the-art IGBT-based modules, the RC-IGBT module will deliver higher output current, lower thermal resistance while ensuring twice as long powercycling lifetime. We will develop and optimise RC-IGBT devices primarily for electric drives for trains which will ensure reliable, more energy efficient and environmentally friendly operation of trains and facilitate growth of the rail network and more efficient transportation of people and goods, a key enabler for urbanisation. Modules with developed 3.3kV RC-IGBTs can also be used in wind turbines and HVDC transmission network and further extended to 1.2kV and 1.7kV voltages and used for electric vehicles and solar PV systems. Thus, the developed RC-IGBT technology will make a significant contribution in solving energy and transportationchallenges facing both rural and urban populations in China in an energy-efficient, sustainable manner.
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