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ECHiPCHeP - Electronics Cooling via Hi Performance Coated Heat Pipes

ECHiPCHeP - Electronics Cooling via Hi Performance Coated Heat Pipes
ECHiPCHeP - 通过高性能涂层热管进行电子冷却
批准号:
131811
负责人:
金额:
$14.31万
依托单位:
依托单位国家:
英国
项目类别:
Feasibility Studies
财政年份:
2015
资助国家:
英国
项目状态:
已结题
起止时间:
2015 至 --

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中文摘要
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英文摘要
Heat Pipes are vital to the thermal management of high performance silicon chips and are present in virtually every new laptop computer. Thermacore is a world leader in heat pipe technology and specialises in thermal management of high performance electronic devices such as for military applications. To protect and expand its position at the high end of the market, Thermacore Europe (TCE) and Oxford nanoSystems (ONS) have, with Brunel University (BU), identified an opportunity to improve the maximum heat flux of a heat pipe by replacing or augmenting the current internal evaporative cooling surface with a high performance nano-coating. The expected benefits including higher power, lower weight and lower cost will allow the UK to maintain its lead in this high value part of the electronics market and the partners to expand into new areas of heat and energy management.
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