ECHiPCHeP - Electronics Cooling via Hi Performance Coated Heat Pipes

ECHiPCHeP - 通过高性能涂层热管进行电子冷却

• 批准号: 131811
• 金额: $ 14.31万
• 依托单位: OXFORD NANOSYSTEMS LTD
• 依托单位国家: 英国
• 项目类别: Feasibility Studies
• 财政年份: 2015
• 资助国家: 英国
• 起止时间: 2015 至 无数据
• 项目状态: 已结题
• 来源: https://gtr.ukri.org/projects?ref=131811
• 关键词: ECHiPCHeP; Electronics; Cooling; via; Hi

Heat Pipes are vital to the thermal management of high performance silicon chips and are present in virtually every new laptop computer. Thermacore is a world leader in heat pipe technology and specialises in thermal management of high performance electronic devices such as for military applications. To protect and expand its position at the high end of the market, Thermacore Europe (TCE) and Oxford nanoSystems (ONS) have, with Brunel University (BU), identified an opportunity to improve the maximum heat flux of a heat pipe by replacing or augmenting the current internal evaporative cooling surface with a high performance nano-coating. The expected benefits including higher power, lower weight and lower cost will allow the UK to maintain its lead in this high value part of the electronics market and the partners to expand into new areas of heat and energy management.

热管对于高性能硅芯片的热管理至关重要，几乎存在于每台新的笔记本电脑中。Thermacore是热管技术的世界领导者，专门从事高性能电子设备的热管理，如军事应用。为了保护和扩大其在高端市场的地位，Thermacore Europe（TCE）和Oxford nanoSystems（ONS）与Brunel University（BU）一起确定了一个机会，通过用高性能纳米涂层替换或增强当前的内部蒸发冷却表面来提高热管的最大热通量。预期的好处包括更高的功率，更低的重量和更低的成本，将使英国能够保持其在电子市场高价值部分的领先地位，并使合作伙伴能够扩展到新的热量和能源管理领域。