Massively Parallel Assembly - A low cost high throughput manufacturing process for MEMS.

大规模并行组装 - MEMS 的低成本高吞吐量制造工艺。

• 批准号: 720807
• 金额: $ 27.59万
• 依托单位: NU NANO LTD
• 依托单位国家: 英国
• 项目类别: GRD Development of Prototype
• 财政年份: 2017
• 资助国家: 英国
• 起止时间: 2017 至 无数据
• 项目状态: 已结题
• 来源: https://gtr.ukri.org/projects?ref=720807
• 关键词: Massively; Parallel; Assembly; low; cost

Accelerometers, gyroscopes and microphones are just some of the everyday applications ofmicroelectromechanical systems (MEMS) that are now ubiquitous components in consumerelectronic devices. As manufacturers of smart phones and tablets endeavour to shrink theirdevices ever further, so the wasted space separating components in these devices becomesever more inhibiting, both in terms of physical size and cost. Separating the manufacturingprocesses of the MEMS component and the host chip can enable massive space and costsavings to be realised, but only if the process designed to subsequently combine the two islow-cost and high-throughput. NuNano is developing a process of this nature which is capableof addressing 400 MEMS components simultaneously and will demonstrate this by manufacturing probes for atomic force microscopy (AFM).These probes, made from silicon, consist of a cantilever and tip, much akin to a record playercantilever and stylus, but the rest of the silicon area is only used for handling. By separatingthe fabrication of the high-precision functional part of the probe and the bulk chip material,a much greater density of devices per wafer will be realised.

加速度计、陀螺仪和麦克风只是微机电系统 (MEMS) 的一些日常应用，微机电系统现已成为消费电子设备中无处不在的组件。随着智能手机和平板电脑制造商努力进一步缩小其设备尺寸，这些设备中浪费的分隔组件的空间在物理尺寸和成本方面都变得越来越具有抑制性。将 MEMS 组件和主机芯片的制造工艺分开可以实现大量空间和成本节省，但前提是随后设计的将两者结合在一起的工艺是低成本和高吞吐量的。 NuNano 正在开发一种这种性质的工艺，能够同时寻址 400 个 MEMS 组件，并将通过制造原子力显微镜 (AFM) 探针来证明这一点。这些探针由硅制成，由悬臂和尖端组成，非常类似于电唱机悬臂和触笔，但硅区域的其余部分仅用于处理。通过将探针的高精度功能部分和大块芯片材料的制造分开，每个晶圆上的器件密度将大大提高。