Fine-Grain Parallel Cellular Processor Arrays in 3D Silicon Technologies

3D 硅技术中的细粒度并行蜂窝处理器阵列

• 批准号: EP/H017453/1
• 负责人: Piotr Dudek
• 金额: $ 69.07万
• 依托单位: University of Manchester
• 依托单位国家: 英国
• 项目类别: Research Grant
• 财政年份: 2009
• 资助国家: 英国
• 起止时间: 2009 至 无数据
• 项目状态: 已结题
• 来源: https://gtr.ukri.org/projects?ref=EP%2FH017453%2F1
• 关键词: Fine; Grain; Parallel; Cellular; Processor

The topic of this proposal is the design of silicon microelectronic circuits that integrate thousands of simple processing cores on a single chip. In particular we will investigate circuits that integrate image sensing and image processing capabilities in a single device. These devices, sometimes called 'vision chips', perform processing using massively parallel cellular processor array architectures. High computational performance and low power consumption of such devices make them uniquely suitable for applications in embedded real-time computer vision applications such as autonomous robots, industrial machine vision, automotive security and driver assistance, interactive toys, visual prosthesis, etc. During the course of the proposed research we will develop novel vision chip circuits and architectures suitable for implementation in emerging microelectronic fabrication technologies, in particular, using 3D integrated (multi-layer stacked die) devices. We will verify our ideas via fabrication of integrated circuit prototypes and by demonstrating their computational capabilities in realistic applications.

该提案的主题是设计硅微电子电路，在单个芯片上集成数千个简单的处理核心。特别是，我们将调查电路，集成图像传感和图像处理功能在一个单一的设备。这些设备有时被称为“视觉芯片”，使用大规模并行蜂窝处理器阵列架构执行处理。这种器件的高计算性能和低功耗使其特别适合于嵌入式实时计算机视觉应用中的应用，例如自主机器人、工业机器视觉、汽车安全和驾驶员辅助、交互式玩具、视觉假体、在拟议的研究过程中，我们将开发适用于新兴微电子制造的新型视觉芯片电路和架构技术，特别是使用3D集成（多层堆叠管芯）器件。我们将通过制造集成电路原型并在实际应用中展示其计算能力来验证我们的想法。

项目成果

Vision chip with high accuracy analog S²I cells

具有高精度模拟 S²I 单元的视觉芯片

• DOI: 10.1109/cnna.2014.6888642
• 发表时间: 2014
• 作者: Carey S

A processor element for a mixed signal cellular processor array vision chip

一种用于混合信号蜂窝处理器阵列视觉芯片的处理器元件

• DOI: 10.1109/iscas.2011.5937875
• 发表时间: 2011
• 作者: Carey S

Mixed signal SIMD processor array vision chip for real-time image processing

用于实时图像处理的混合信号 SIMD 处理器阵列视觉芯片

• DOI: 10.1007/s10470-013-0192-x
• 发表时间: 2013
• 期刊: Analog Integrated Circuits and Signal Processing
• 影响因子: 1.4
• 作者: Carey S

Low power high-performance smart camera system based on SCAMP vision sensor

基于SCAMP视觉传感器的低功耗高性能智能摄像系统

• DOI: 10.1016/j.sysarc.2013.03.016
• 发表时间: 2013
• 期刊: Journal of Systems Architecture
• 影响因子: 4.5
• 作者: Carey S

Demonstration of a low power image processing system using a SCAMP3 vision chip

使用 SCAMP3 视觉芯片的低功耗图像处理系统演示

• DOI: 10.1109/icdsc.2011.6042959
• 发表时间: 2011
• 作者: Carey S