Embedded Integrated Intelligent Systems for Manufacturing

用于制造的嵌入式集成智能系统

• 批准号: EP/P027482/1
• 负责人: Andrew West
• 金额: $ 204.92万
• 依托单位: Loughborough University
• 依托单位国家: 英国
• 项目类别: Research Grant
• 财政年份: 2017
• 资助国家: 英国
• 起止时间: 2017 至 无数据
• 项目状态: 已结题
• 来源: https://gtr.ukri.org/projects?ref=EP%2FP027482%2F1
• 关键词: Embedded; Integrated; Intelligent; Systems; Manufacturing

This proposal seeks to provide a platform for strategic research and impact activities within the embedded integrated intelligent systems (EIIS) domain. This research area covers all aspects of designing and developing products and processes that can demonstrate adaptation and learning (i.e. in terms of self - organising, adapting, configuring, optimising, protecting and healing), at the system or service level based upon intelligent sensing and actuation at the granularity of the individual components. The multidisciplinary nature of the domain is challenging since successful deployment and adoption within the harsh industrial environment requires advancements in several areas (e.g. (1) materials, antennae design, embedded power sources, energy harvesting, real-time software architectures, embedded processing and robust wireless communications protocols at the device level and (2) optimisation, visualisation, analytics, machine learning and digital manufacturing at the systems science and services level). The EIIS group at Loughborough University was founded in 2007 and currently comprises 35 staff (academics (A), post doctoral research associates (PDRA) and postgraduate research students (PhD)). This proposal will enable the team to develop the EIIS strategic research agenda in line with industrial collaborators' (e.g. automotive, electronics, aerospace, sport, healthcare and end of life processing), EPSRC and Government strategies via "ideas factory" colloquia, short-term feasibility studies into "hot topics" and multi-disciplinary responsive-mode submissions to funding bodies (e.g. EPSRC, innovateUK, EU, APC/BIS, Wellcome).The funding will also support the development of a pipeline of expertise in EIIS for UK industry and academia. Undergraduates will be supported via internships in industry or academia to expose the next generation of talent to the EIIS opportunities and challenges and also provide research resource for junior members of the EIIS group. Current EIIS members will also be funded to attend technical, business and innovation courses provided by academia and / or industry and encouraged to take long term (i.e. 3 month) sabbaticals within industry and alternative world leading academic or technology transfer institutions to enable the group to identify best global practices and determine relevant benchmarks for success of the research.

该提案旨在为嵌入式集成智能系统（EIIS）领域内的战略研究和影响活动提供一个平台。该研究领域涵盖了设计和开发产品和流程的各个方面，这些产品和流程可以在系统或服务层面上展示适应和学习（即自组织，适应，配置，优化，保护和修复），基于单个组件粒度的智能传感和驱动。该领域的多学科性质具有挑战性，因为在恶劣的工业环境中成功部署和采用需要在几个领域取得进展（例如，（1）材料、天线设计、嵌入式电源、能量收集、实时软件架构、嵌入式处理和设备级的鲁棒无线通信协议，以及（2）优化、可视化、分析，系统科学和服务层面的机器学习和数字制造）。拉夫堡大学的EIIS小组成立于2007年，目前包括35名工作人员（学者（A），博士后研究助理（PDRA）和研究生研究生（博士））。该提案将使该团队能够根据工业合作者的要求制定EIIS战略研究议程。（例如汽车、电子、航空航天、体育、医疗保健和报废处理）、EPSRC和政府战略，通过“创意工厂”座谈会、对“热门主题”的短期可行性研究和向资助机构提交多学科响应模式（例如EPSRC、innovateUK、EU、APC/BIS、Wellcome）。该资金还将支持为英国工业和学术界开发EIIS专业知识管道。本科生将通过在行业或学术界实习的支持，使下一代人才接触到EIIS的机遇和挑战，并为EIIS集团的初级成员提供研究资源。目前的EIIS成员还将获得资助，参加学术界和/或工业界提供的技术，商业和创新课程，并鼓励他们在工业界和其他世界领先的学术或技术转让机构内进行长期（即3个月）休假，以使该小组能够确定最佳全球实践并确定研究成功的相关基准。

项目成果

Analysing the decisions involved in building a Digital Twin for predictive maintenance

分析构建用于预测性维护的数字孪生所涉及的决策

• 作者: Carlin H M

An Embedded Intelligence Future Vision of Flexible Configurable Manufacturing

嵌入式智能灵活可配置制造的未来愿景

• 发表时间: 2020
• 作者: Goodall P

Ultrasonic additive manufacturing using feedstock with build-in circuitry for 3D metal embedded electronics

• DOI: 10.1016/j.addma.2019.100799
• 发表时间: 2019-10-01
• 期刊: ADDITIVE MANUFACTURING
• 影响因子: 11
• 作者: Bournias-Varotsis, Alkaios;Han, Xiaoxiao;Engstrom, Daniel S.
• 通讯作者: Engstrom, Daniel S.

Ultrasonic Additive Manufacturing as a form-then-bond process for embedding electronic circuitry into a metal matrix

• DOI: 10.1016/j.jmapro.2018.03.027
• 发表时间: 2018-04-01
• 期刊: JOURNAL OF MANUFACTURING PROCESSES
• 影响因子: 6.2
• 作者: Bournias-Varotsis, Alkaios;Friel, Ross J.;Engstrom, Daniel S.
• 通讯作者: Engstrom, Daniel S.

The Effect of Energy Density and Nb Content on the Microstructure and Mechanical Properties of Selective Laser Melted Ti-(10-30 wt.%) Nb

• DOI: 10.1007/s11665-021-06239-5
• 发表时间: 2021-09
• 期刊: Journal of Materials Engineering and Performance
• 影响因子: 2.3
• 作者: J. Borgman;Jing Wang;L. Zani;P. Conway;C. Torres-Sánchez