Q-dot-Glass based Thermoelectric Cooling (Q-Dot-TEC) by Thermal Energy Harvesting
Q-dot-Glass based Thermoelectric Cooling (Q-Dot-TEC) by Thermal Energy Harvesting
批准号:
EP/X032612/1
负责人:
GEETA SHARMA
金额:
$26.0万
依托单位:
依托单位国家:
英国
项目类别:
Fellowship
财政年份:
2023
资助国家:
英国
项目状态:
未结题
起止时间:
2023 至 --
中文摘要
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英文摘要
The technology has evolved drastically over various stages of industrial revolution from usage of coal, steam and water to current stage chip technology, artificial intelligence and big data which relies on lots of data transfer (5G). With data as new oil, data centres will need large storage capacities which in turn increases power consumption of ICT sector. The energy demand in ICT sector implies that global carbon footprint for increasing the capacity of digital infrastructure may become unsustainable at a current rate in future!Hence the present proposal aims to develop a novel single platform technology using on-chip energy harvesting of heat dissipated by electronic and photonic chips during their operation. The future of manufacturing PICs will adapt with the software design options by incorporating on-chip thermal management programme, which will then become a part of the chip substrate and component assembly process using the advanced robotic technology. The missing feature in robotically controlled integration has been thermal management engineering and its implementation on chip at low cost and power budget. Our methodology is based on engineering a unique chip using Q-dot doped glass during manufacturing. This chip will constitute Q-dot glass layer on SOI substrate, followed by selective growth of n- and p-type semiconductor layers on it. The heat dissipated from operating components will be absorbed by Qdot glass which then be transferred to adjoining n and p-type semiconducting layers for the generation of charge carriers. These charge carriers will generate current. This project will be a cross-disciplinary project which aims to provide solution for an outstanding problem of heat dissipation in the existing chip technology (electronic and the PICs) and future energy crisis using (i) Materials synthesis and deposition ii) Materials characterizations iii) Device based characterisation iv) Manufacturability of the thermal energy harvesting devices.
期刊论文(2)
专著(0)
科研奖励(0)
会议论文
Encyclopedia of Materials: Electronics
材料百科全书:电子
DOI:
10.1016/b978-0-12-819728-8.00014-0
发表时间:
2023
期刊:
影响因子:
--
作者:
[Jha A]
通讯作者:
Jha A
国内基金
海外基金
过碱性流纹岩的成因及其Fe同位素研究——以澳大利亚Glass House地区和东昆仑造山带东段为例
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批准号:41803028
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项目类别:青年科学基金项目
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资助金额:26.0万元
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批准年份:2018
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负责人:邵凤丽
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依托单位:
Er:Glass NPRO激光强度噪声的全量子理论分析与实验研究
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批准号:61308041
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项目类别:青年科学基金项目
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资助金额:26.0万元
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批准年份:2013
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负责人:王云祥
-
依托单位:
新型全固化Yb:glass自锁模激光器的研究
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批准号:69978016
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项目类别:面上项目
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资助金额:14.5万元
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批准年份:1999
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负责人:张伟力
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依托单位: