Q-dot-Glass based Thermoelectric Cooling (Q-Dot-TEC) by Thermal Energy Harvesting

从煤炭、蒸汽和水的使用，到目前阶段的芯片技术、人工智能和依赖于大量数据传输(5G)的大数据，这项技术在工业革命的不同阶段发生了戏剧性的演变。随着数据成为新的石油，数据中心将需要巨大的存储容量，这反过来又增加了信通技术部门的电力消耗。信息和通信技术领域的能源需求意味着，以目前的速度增加数字基础设施容量的全球碳足迹可能在未来变得不可持续！因此，本提案旨在开发一种新型的单平台技术，利用芯片上的能量收集电子和光子芯片在运行过程中散热。制造PIC的未来将通过整合芯片上的热管理程序来适应软件设计选项，然后该程序将成为使用先进机器人技术的芯片基板和组件组装过程的一部分。机器人控制集成中缺少的功能是热管理工程及其在低成本和低功率预算的芯片上的实现。我们的方法是设计一种独特的芯片，在制造过程中使用Q点掺杂玻璃。该芯片将在SOI衬底上形成Q点玻璃层，然后在其上选择性生长n型和p型半导体层。工作元件散发的热量将被Qdot玻璃吸收，然后转移到相邻的n型和p型半导体层，以产生电荷载流子。这些电荷载体会产生电流。该项目将是一个跨学科的项目，旨在为现有芯片技术(电子和PIC)中的一个突出的散热问题和未来的能源危机提供解决方案，使用(I)材料合成和沉积，ii)材料表征，iii)基于器件的表征，iv)热能收集设备的可制造性。

The technology has evolved drastically over various stages of industrial revolution from usage of coal, steam and water to current stage chip technology, artificial intelligence and big data which relies on lots of data transfer (5G). With data as new oil, data centres will need large storage capacities which in turn increases power consumption of ICT sector. The energy demand in ICT sector implies that global carbon footprint for increasing the capacity of digital infrastructure may become unsustainable at a current rate in future!Hence the present proposal aims to develop a novel single platform technology using on-chip energy harvesting of heat dissipated by electronic and photonic chips during their operation. The future of manufacturing PICs will adapt with the software design options by incorporating on-chip thermal management programme, which will then become a part of the chip substrate and component assembly process using the advanced robotic technology. The missing feature in robotically controlled integration has been thermal management engineering and its implementation on chip at low cost and power budget. Our methodology is based on engineering a unique chip using Q-dot doped glass during manufacturing. This chip will constitute Q-dot glass layer on SOI substrate, followed by selective growth of n- and p-type semiconductor layers on it. The heat dissipated from operating components will be absorbed by Qdot glass which then be transferred to adjoining n and p-type semiconducting layers for the generation of charge carriers. These charge carriers will generate current. This project will be a cross-disciplinary project which aims to provide solution for an outstanding problem of heat dissipation in the existing chip technology (electronic and the PICs) and future energy crisis using (i) Materials synthesis and deposition ii) Materials characterizations iii) Device based characterisation iv) Manufacturability of the thermal energy harvesting devices.