MICRORIBBON CABLE FOR IMPLANTABLE MICROELECTRONICS
用于植入式微电子学的微带电缆
基本信息
- 批准号:6210831
- 负责人:
- 金额:$ 9.99万
- 依托单位:
- 依托单位国家:美国
- 项目类别:
- 财政年份:2000
- 资助国家:美国
- 起止时间:2000-09-15 至 2001-08-31
- 项目状态:已结题
- 来源:
- 关键词:
项目摘要
Implantable micromachined electrode arrays, in the short term, are highly valuable research tools, and in the long run will have a great impact on rehabilitation of patients with various disabilities. In a chronic system, an interconnect forms the critical link between the micro electrode to the external world through a percutaneous connector. University of Michigan has integrated their probes with miniature, flexible, multilead silicon ribbon interconnects. The critical issue is that the ribbons are inherently fragile being made from thinned down silicon, and are prone to breakage as a result of the mechanical stresses created by tissue contraction during the healing process. To overcome these limitations, a polyimide flex cable and a discrete connector are being investigated. Preliminary testing of polyimide cables has indicated that it is unsuitable for chronic implants. The proposed effort will focus on replacing polyimide ribbon cables and discrete connectors with an integrated rigid flex circuit made out of a class of biocompatible materials known as liquid crystal polymers (LCP) with a unique combination of properties. Compared to polyimides, LCPs absorb virtually no moisture and not susceptible to hydrolysis. The ribbon cable and the connector are fabricated as one piece. Integrating the connector with the flex cable represents a major advancement compared to the current hybrid approach. This eliminates one level of interconnections, and results in a much smaller percutaneous connector compared to current discrete connectors. Ultimately, the cable will be bonded to the neural probe with a planar flip-chip bond, eliminating the need for wire bonds. Elimination of wire bonds will reduce the profile height and eliminate a major reliability concern. PROPOSED COMMERCIAL APPLICATION: The proposed technology development will enable the broader acceptance and use of micro probe/stimulator technology. Although at present this is a niche market with several hundred probes are being distributed by University of Michigan on a monthly basis, the packaging technology is expected to enable its wide spread application in neurophysiology and in the treatment of chronic neural disorders such as paralysis, deafness and blindness.
植入式微机械电极阵列在短期内是非常有价值的研究工具,从长远来看将对各种残疾患者的康复产生巨大影响。在慢性系统中,互连通过经皮连接器形成微电极与外部世界之间的关键链接。密歇根大学已经将他们的探头与微型、柔性、多引线硅带互连集成在一起。关键的问题是,由减薄的硅制成的带固有地脆弱,并且由于在愈合过程中由组织收缩产生的机械应力而易于断裂。为了克服这些限制,正在研究聚酰亚胺柔性电缆和分立连接器。聚酰亚胺电缆的初步测试表明,它不适合长期植入。拟议的努力将集中在取代聚酰亚胺带状电缆和离散连接器与集成的刚性柔性电路制成的一类生物相容性材料称为液晶聚合物(LCP)具有独特的性能组合。与聚酰亚胺相比,LCP几乎不吸收水分,不易水解。带状电缆和连接器制造为一个整体。与当前的混合方法相比,将连接器与柔性电缆集成代表了重大进步。这消除了一个级别的互连,并且与当前的分立连接器相比,导致小得多的经皮连接器。最终,电缆将通过平面倒装芯片键合与神经探针键合,从而消除了对引线键合的需要。消除引线键合将降低轮廓高度并消除主要的可靠性问题。拟议的商业应用:拟议的技术开发将使微探针/刺激器技术得到更广泛的接受和使用。虽然目前这是一个利基市场,密歇根大学每月分发数百个探针,但预计包装技术将使其在神经生理学和治疗慢性神经疾病(如麻痹,耳聋和失明)中得到广泛应用。
项目成果
期刊论文数量(0)
专著数量(0)
科研奖励数量(0)
会议论文数量(0)
专利数量(0)
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BRIAN P FARRELL其他文献
BRIAN P FARRELL的其他文献
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{{ truncateString('BRIAN P FARRELL', 18)}}的其他基金
Low-Cost Hermetic Packaging for Implantable electronics
用于植入式电子产品的低成本气密包装
- 批准号:
6693605 - 财政年份:2003
- 资助金额:
$ 9.99万 - 项目类别:
Neurotrophic LCP Plastic Substrate Nerve Electrode Array
神经营养性 LCP 塑料基板神经电极阵列
- 批准号:
6646388 - 财政年份:2003
- 资助金额:
$ 9.99万 - 项目类别:
Microribbon Cable/Connector for Implantable Electronics
用于植入式电子产品的微带电缆/连接器
- 批准号:
6802639 - 财政年份:2000
- 资助金额:
$ 9.99万 - 项目类别:
Microribbon Cable/Connector for Implantable Electronics
用于植入式电子产品的微带电缆/连接器
- 批准号:
6669156 - 财政年份:2000
- 资助金额:
$ 9.99万 - 项目类别:
Microribbon Cable/Connector for Implantable Electronics
用于植入式电子产品的微带电缆/连接器
- 批准号:
6587454 - 财政年份:2000
- 资助金额:
$ 9.99万 - 项目类别: