Low-Cost Hermetic Packaging for Implantable electronics

用于植入式电子产品的低成本气密包装

• 批准号: 6693605
• 负责人: BRIAN P FARRELL
• 金额: $ 10.08万
• 依托单位: FOSTER-MILLER, INC.
• 依托单位国家: 美国
• 财政年份: 2003
• 资助国家: 美国
• 起止时间: 2003-09-15 至 2005-06-30
• 项目状态: 已结题
• 来源: https://reporter.nih.gov/project-details/6693605
• 关键词: biomaterial development /preparation; biomaterial evaluation; biomaterial interface interaction; biomedical equipment development; electrical property; implant; nervous system prosthesis; optics; packaging material; polymers; telemetry

DESCRIPTION (provided by applicant): While implantable electronic systems continue to show tremendous promise, major deficiencies remain in the area of packaging and interconnection. Foster-Miller, in this proposed effort, will develop and demonstrate a new, low-cost, highly reliable, hermetic packaging technology for implantable electronics. This new packaging platform is based on remarkable new class of materials known as thermoplastic Liquid Crystal Polymers (LCPs). Foster-Miller has been developing an electronic packaging technology based on these innovative LCPs for a host of electronic and optoelectronic applications. More recently, Foster-Miller has been applying their LCP film technology to the biomedical world, in particular in the area of neural prostheses. Foster-Miller is currently funded by NINDS to develop LCPbased microribbon cables as a direct replacement for existing silicon and polyimide cables. This work has shown great early promise with the LCP materials proving both extremely insulative (electrically) and biologically inert. This proposed effort builds on this early promise to expand the technology to address the packaging of implanted electronics. In addition to their excellent electrical properties, LCPs have barrier properties comparable to glass, several orders of magnitude greater than most other polymers, thus offering the potential of a plastic hermetic packaging technology, a hitherto unimaginable concept.

描述（由申请人提供）： 虽然植入式电子系统继续显示出巨大的前景，但在封装和互连领域仍存在重大缺陷。Foster-Miller公司将开发和展示一种新的、低成本、高可靠性的、用于植入式电子产品的密封封装技术。这种新的包装平台是基于一种被称为热塑性液晶聚合物（LCP）的新型材料。Foster-Miller一直在开发基于这些创新LCP的电子封装技术，用于许多电子和光电应用。最近，Foster-Miller将其LCP薄膜技术应用于生物医学领域，特别是神经假体领域。Foster-Miller目前由NINDS资助，开发基于LCP的微硅电缆，作为现有硅和聚酰亚胺电缆的直接替代品。这项工作已经显示出很大的早期承诺与LCP材料证明了极端绝缘（电）和生物惰性。这一提议的努力建立在这一早期承诺的基础上，以扩展该技术，以解决植入电子产品的包装问题。除了优异的电气性能外，LCP还具有与玻璃相当的阻隔性能，比大多数其他聚合物高出几个数量级，从而提供了塑料密封包装技术的潜力，这是迄今为止无法想象的概念。