Integrating photonic circuits with silicon electronics for low power computing

点击翻译按钮获取中文摘要

Optical communications systems have driven the massive increases in bandwidth and energy efficiency of networks from long haul down to chip-chip dimensions. On-chip, electronic miniaturisation is reaching physical limits and advances in computing power are being driven by distributed processing models and multi-core architecture design. The interconnections between sub-chip areas are becoming bottlenecks to further scaling of these systems. In order to create high bandwidth, low power consumption connections on silicon chips, this work will extend the reach of photonic systems to the intra-chip level.At the Institute of Photonics we have developed a method by which ultra-compact optoelectronic devices can be physically printed onto different substrates. This project will develop the next generation of 3D optoelectronic chips, created by a direct, multilayer transfer printing. Particular research challenges will include the development of ultra-low power consumption photonic membrane devices and their direct nanoscale integration onto foundry sourced silicon electronic chips.The student will gain expertise in a wide range of micro-fabrication technologies, seeing their work transfer from design through to characterisation in the laboratory. In addition to micro-fabrication the student will also be involved in the design and simulation of devices, measurement and characterisation and numerical processing of results.