Integration of Wide Bandgap semiconductors for Embedded Motor Drives

该项目将解决在嵌入式驱动器中使用宽带隙半导体的潜在好处，分析的关键任务：-低损耗开关器件对效率的影响。-分析使用多极电机在功率转换器分区方面的好处。分析使用多极电机在更高功率密度方面的优势。通过使用更多的极对数和增加的电气基频来分析任何电机功率密度的增加。研究热管理，并在降低开关损耗和减小尺寸之间进行权衡。检查使用更高的开关频率以及对输入滤波器尺寸和成本的影响。创建一个报告，概述上述内容，用作技术门，以决定前进到真实的演示的路线。开发一个演示器，在实践中探索上述权衡和算法。本研究项目将主要集中于探索功率半导体和无源器件的不同拓扑结构，以促进功率转换器与电机的集成，从而节省典型推进系统中的大量材料和电缆。这些不同的拓扑结构将利用宽带隙半导体的快速开关、低损耗和高温能力，以减小功率转换器的尺寸。拓扑研究还应考虑电机的要求，并减轻和控制宽带隙可能导致的高dV/dT应力的破坏性影响。半导体、无源器件和电机绕组的封装和集成的新方法也将被考虑，以实现集成驱动结构的成本效益方式。

The project will address the potential benefits of using wide bandgap semiconductors within embedded drives, key tasks to analyse:- Effect of low loss switching devices on efficiency.- Analyse the benefits of using multi-pole motors with respect to partitioning of power converters.- Analyse the benefits of using multi-pole motors with respect to higher power density.- Analyse any motor power density increases by using higher number of pole pairs and increased electrical fundamental frequency.- Look into the thermal management and tradeoff with reduced switching losses and reduced heatsink size.- Examine the use of higher switching frequencies and the effect on the input filter size and cost.- Create a report outlining the above to be used as a technology gate to decide the route forward to real demonstration.- Develop a demonstrator to explore in practice the tradeoffs and algorithms developed above.This research project will mostly focus on exploring different topological arrangements of power semiconductor and passive devices to facilitate the integration of the power converter with the electrical machine thus saving significant material and cabling in a typical propulsion system. These different topologies will utilize the fast switching, low loss, and high-temperature capabilities of wide band gap semiconductors in order to reduce the size of the power converter. The topological research shall also consider the requirements of the motor and mitigate and control the damaging effects of the high dV/dT stress that the wide band-gap can potentially cause. New methods of packaging and integration of semiconductors, passives and motor windings will also be considered to enable cost effective ways to realise the integrated drive structures.