Advanced modelling and simulation of smart power ICs and packages for operation at 225 C in automotive Electronics (ADAM-SPICE)

汽车电子中可在 225 C 下运行的智能功率 IC 和封装的高级建模和仿真 (ADAM-SPICE)

• 批准号: EP/D034000/2
• 负责人: Shankar Ekkanath-Madathil
• 金额: --
• 依托单位: University of Sheffield
• 依托单位国家: 英国
• 项目类别: Research Grant
• 财政年份: 2007
• 资助国家: 英国
• 起止时间: 2007 至 无数据
• 项目状态: 已结题
• 来源: https://gtr.ukri.org/projects?ref=EP%2FD034000%2F2
• 关键词: Advanced; modelling; simulation; smart; power

High Temperature Silicon electronics are becoming increasingly necessary for automotive control applications such as Engine Control Units (ECU) because of government requirements to rapidly reduce engine emissions. The ECUs in conventional and hybrid cars are made of multi-chip modules (MCM), reflecting the requirements of digital, analog and power functions. However, MCMs suffer from long term reliability issues, despite improvements made in recent years. Replacing these with power ICs, which have bipolar analog, CMOS digital and power functions built onto one chip will result in highly compact, lightweight and low cost ECUs. However, to our knowledge, very few, if any, such power IC technologies exist, which can operate at 42 V and sustain the temperature requirements of 200 degreeC or more. The available design software tools for device modelling, circuit parameter extraction, and the rules for device and circuit layout are applicable for temperatures only up to 175 degreeC. This necessitates development of models (empirical, mathematical and SPICE) and establish design criteria for low and high voltage semiconductor device components and packages for Si smart power ICs operating at high temperatures (225 degreeC) in automotive applications. Rapidly developing design methodologies, simulation and modelling tools will enable (a) reduction of design cycle time (b) reduce cost and (c) enable long term reliability of components and packages, and; (d) shorten time to market.

由于政府要求快速减少发动机排放，高温硅电子器件对于发动机控制单元（ECU）等汽车控制应用越来越有必要。传统和混合动力汽车中的ECU由多芯片模块（MCM）制成，反映了数字、模拟和电源功能的要求。然而，尽管近年来做出了改进，但MCM仍存在长期可靠性问题。用功率IC取代这些芯片，将双极模拟、CMOS数字和功率功能内置在一个芯片上，将产生高度紧凑、重量轻和低成本的ECU。然而，据我们所知，很少有（如果有的话）这样的功率IC技术存在，它可以在42 V下工作，并维持200 ℃或更高的温度要求。用于器件建模、电路参数提取以及器件和电路布局规则的现有设计软件工具仅适用于高达175 ℃的温度。这就需要开发模型（经验、数学和SPICE），并为汽车应用中高温（225 ℃）下工作的硅智能功率IC建立低压和高压半导体器件组件和封装的设计标准。快速开发设计方法、模拟和建模工具将能够：（a）缩短设计周期时间;（B）降低成本;（c）实现部件和封装的长期可靠性;（d）缩短上市时间。