High Efficency Laser Processing Systems (HELPS)

半导体激光技术有可能为材料加工提供比目前可用的更有效的工业激光光源。然而，到目前为止，糟糕的束流质量将市场渗透率限制在相对较小的几个领域，如焊接和塑料焊接。该项目旨在利用由合作伙伴组织单独持有的关键技术的组合，并将它们结合在一起，开发具有足够好的光束质量的光纤耦合二极管激光光源，以适用于广泛的主流应用。具体地说，这将包括显著提高当前基于激光的焊接工艺的效率，使其甚至比传统的MIG或其他技术更有效。主要研究活动将是1)演示功率水平为200-1000W的能量高效、高亮度的二极管激光(DL)模块，并将其耦合到0.15 mm光纤中；2)将这些模块分阶段开发为原型标准-允许并行工作在更高功率的原型DL模块上；3)针对焊接、标记和切割的DL模块进行应用研究。4)将4kW的功率/亮度组合到0.25 mm光纤中的DL模块组合的新架构5)节能焊接工艺研究和应用试验

Diode laser technology has the potential to provide significantly more efficient industrial laser sources for materials processing than are currently available. However poor beam quality has so far limited market penetration to a few relatively small niches such as soldering and plastics welding. This project aims to exploit a combination of key technologies held separately by the partner organisations and bring them together to develop fiber coupled diode laser sources with beam qualities good enough to be applicable to broad range of mainstream applications. Specifically this will include a significant increase in the efficiency of current laser based welding processes to the point where they are more efficient than even conventional MIG or other techniques.The main research activities will be 1) Demonstration of propotype energy effficient, high brightness, diode laser (DL) modules at power levels 200-1000W coupled into 0.15mm fibre;2) Development of these modules to prototype standard on a staged basis - allowing parallel work on higher power prototype DL modules; 3) Applications research on DL modules for welding, marking, and cutting. 4) Novel architectures for DL module combination to achieve power/brightness of 4kW into 0.25mm fibre5) Research on energy saving welding processes and applications trials