Substrate integrated circuits (SICs) for radio-frequency (RF), millimetre-wave and microwave photonic system applications

用于射频 (RF)、毫米波和微波光子系统应用的基板集成电路 (SIC)

• 批准号: 122137-2007
• 负责人: Wu, Ke
• 金额: $ 4.27万
• 依托单位: École Polytechnique de Montréal
• 依托单位国家: 加拿大
• 项目类别: Discovery Grants Program - Individual
• 财政年份: 2007
• 资助国家: 加拿大
• 起止时间: 2007-01-01 至 2008-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=364529
• 关键词: Substrate; integrated; circuits; SICs; radio

The applicant pioneered and has successfully demonstrated the "substrate integrated circuits (SICs)" concept for application in future radio-frequency (RF), millimetre-wave and microwave photonic integrated circuits and systems. This 5-year project is concerned with further research and development for demonstrating the uniqueness and usefulness of this possibly revolutionary integrated circuit technique.This research allows the applicant to lead international efforts in searching for future generations of low cost, high performance and fully integrated circuits and systems. Theoretical and experimental activities will be conducted for discovering new circuit features, new design rules, new innovative devices, and new application areas of the SICs, which will involve unconventional and multilayered substrates. Fundamental guided-wave properties will be investigated for new classes of SICs-based waveguide structures, new modeling and design techniques will be studied and developed with hybrid field/circuit models, and selected experimental prototypes will be made and demonstrated for passive/active circuit and antenna applications. This project will foster substantial interests of this new concept for future high-frequency, in particular millimetre-wave system design towards complete hybrid and monolithic system-on-substrate integration and miniaturization.The proposed SICs design platform allows bridging the technological gap between high-frequency electronic and photonic circuits and systems. A successful commercialization of such circuits and systems depends on cost/performance and mass-reproducible characteristics. This project promises to provide a valuable edge in meeting this goal. The new knowledge generated from this project and the training of highly qualified personnel will be critical in stimulating the development of Canadian high-technology sectors, thereby enhancing Canada's global competitiveness.

申请人开创并成功展示了“衬底集成电路（SIC）”概念，可应用于未来射频（RF）、毫米波和微波光子集成电路和系统。这个为期 5 年的项目涉及进一步的研究和开发，以证明这种可能具有革命性的集成电路技术的独特性和实用性。这项研究使申请人能够引领国际努力，寻找下一代低成本、高性能和全集成电路和系统。将开展理论和实验活动，以发现 SIC 的新电路特征、新设计规则、新创新器件和新应用领域，其中将涉及非常规和多层基板。将研究基于 SIC 的新型波导结构的基本导波特性，将利用混合场/电路模型研究和开发新的建模和设计技术，并将为无源/有源电路和天线应用制作和演示选定的实验原型。该项目将促进人们对未来高频这一新概念的重大兴趣，特别是毫米波系统设计，以实现完全混合和单片系统基片集成和小型化。所提出的 SIC 设计平台可以弥合高频电子和光子电路与系统之间的技术差距。此类电路和系统的成功商业化取决于成本/性能和可大规模再现的特性。该项目有望为实现这一目标提供宝贵的优势。该项目产生的新知识和高素质人才的培训对于刺激加拿大高科技行业的发展至关重要，从而增强加拿大的全球竞争力。