In-chip communication using UWB for 3D integration

使用 UWB 进行片内通信进行 3D 集成

• 批准号: 238970-2008
• 负责人: Dinh, AnhVan
• 金额: $ 1.09万
• 依托单位: University of Saskatchewan
• 依托单位国家: 加拿大
• 项目类别: Discovery Grants Program - Individual
• 财政年份: 2009
• 资助国家: 加拿大
• 起止时间: 2009-01-01 至 2010-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=425749
• 关键词: chip; communication; using; UWB; 3D

The current trend toward a new class of products called convergent system integrates many functions (voice, video and data) and many different technologies (digital, RF, analog and optical) into one. This trend can be visualized with four approaches: system-on-chip (SOC), multichip module (MCM), system-in-package (SIP) and system-on-package (SOP). The architecture in 3-D integrated circuits provides a convergent system, the many-in-one package, with good performance and less power. There must be interconnections between the dies or chips within the system for communication purposes. Wireless interconnection has been proven outperforming the wire communication in the ICs since it provides high speed with more compact and lower cost for multi-function IC's.

目前的趋势是一种称为融合系统的新型产品，它将许多功能（语音、视频和数据）和许多不同的技术（数字、RF、模拟和光学）集成为一体。这种趋势可以通过四种方法来实现：系统级芯片（SOC）、多芯片模块（MCM）、系统级封装（SIP）和系统级封装（SOP）。三维集成电路的结构提供了一个收敛的系统，多合一封装，具有良好的性能和更低的功耗。为了通信的目的，在系统内的管芯或芯片之间必须存在互连。无线互连已被证明优于集成电路中的有线通信，因为它提供了更紧凑和更低成本的多功能集成电路的高速。