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Experimental validation of DreamWafer (TM) microfabrication with thermal/ mechanical and distributed power control, interconnecting chips, PCBs and mechanical structures

Experimental validation of DreamWafer (TM) microfabrication with thermal/ mechanical and distributed power control, interconnecting chips, PCBs and mechanical structures
通过热/机械和分布式功率控制、互连芯片、PCB 和机械结构对 DreamWafer (TM) 微加工进行实验验证
批准号:
363580-2007
负责人:
Savaria, Yvon
金额:
$30.43万
依托单位国家:
加拿大
项目类别:
Collaborative Research and Development Grants
财政年份:
2009
资助国家:
加拿大
项目状态:
已结题
起止时间:
2009-01-01 至 2010-12-31

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项目成果

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中文摘要
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英文摘要
Complex electronic systems are built with separate integrated circuits (ICs) affixed to printed circuit boards
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Hardware support for reliable networking; from protocols to accelerators
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  • 项目类别:
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  • 资助金额:
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  • 财政年份:
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  • 项目类别:
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  • 资助金额:
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  • 项目类别:
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  • 财政年份:
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  • 依托单位:
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  • 批准号:
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  • 项目类别:
    Industrial Research Chairs
  • 资助金额:
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  • 财政年份:
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