VairCRAFT : Versatile Systems-on-Chip Integration to Reduce Aircraft Weight and Gas Emission

VairCRAFT：多功能片上系统集成，可减少飞机重量和气体排放

• 批准号: 522883-2017
• 负责人: Savaria, Yvon
• 金额: $ 24.19万
• 依托单位: École Polytechnique de Montréal
• 依托单位国家: 加拿大
• 项目类别: Collaborative Research and Development Grants
• 财政年份: 2019
• 资助国家: 加拿大
• 起止时间: 2019-01-01 至 2020-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=694825
• 关键词: VairCRAFT; Versatile; Systems; Chip; Integration

Nowadays the number of sensors, actuators and corresponding bulky electronic systems as well as their related power and data cables, which occupy a remarkable space and increase the weight of aircrafts, are rapidly growing in modern aircrafts. The resulting consequences have made the aeronautic and aerospace industries actively look for solutions to miniaturize conventional electronic systems and their related accessories to reduce the bulkiness and weight. Reconfigurable systems, System-on-chip (SoC), where electronic parts are integrated on a single chip and system-in-package (SiP), where different SoC made of different technologies are integrated on a single package, are alternatives to achieve that level of miniaturization. Referring to the mentioned concepts, the main objective of this research is to integrated building blocks for a versatile aircraft (VairCRAFT). This will not only have impressive impacts on reducing the weight of aircrafts and its consequences, but it also provides a mean to have a higher level of versatility which is important in an aircraft due to different sensor and actuator specifications. To achieve above objective, different sensor interfaces will be integrated over SoCs or SiPs. Such sensor interfaces are supposed to generate required currents and voltages to excite different sensors and actuators, e.g. linear variable differential transformers, through power electronic circuits e.g. power amplifiers. That is why the sensor interfaces must be versatile. Read back circuits, which includes filters, sense amplifiers and data converters, are supposed to monitor and control the sensor interfaces. Once integrated, different chips will individually be evaluated first and the individual characterized chips will be integrated on a single package to provide a miniaturized sensor interface prototype. These efforts bring economic and environmental benefits by drastically diminishing the consumed fuel and greenhouse emissions, respectively.

在现代飞机中，传感器、执行器和相应的庞大的电子系统以及与之相关的电源和数据电缆的数量正在迅速增加，它们占用了很大的空间，增加了飞机的重量。由此产生的后果使得航空和航天工业积极寻找解决方案，使传统电子系统及其相关配件小型化，以减少体积和重量。可重构系统，片上系统（SoC），其中电子部件集成在单个芯片上，系统级封装（SiP），其中由不同技术制成的不同SoC集成在单个封装上，是实现该级别小型化的替代方案。参考上述概念，本研究的主要目标是为多功能飞机（VairCRAFT）集成构建模块。这不仅将对减轻飞机重量及其后果产生令人印象深刻的影响，而且还提供了一种具有更高水平的多功能性的手段，这在飞机上是很重要的，因为不同的传感器和执行器规格。为了实现上述目标，不同的传感器接口将集成在soc或sip上。这些传感器接口应该通过功率放大器等电力电子电路产生所需的电流和电压来激励不同的传感器和执行器，例如线性可变差动变压器。这就是为什么传感器接口必须是通用的。包括滤波器、感测放大器和数据转换器在内的回读电路被用来监视和控制传感器接口。一旦集成，不同的芯片将首先单独进行评估，并且各个特征芯片将集成在单个封装上，以提供小型化的传感器接口原型。这些努力分别大大减少了燃料消耗和温室气体排放，带来了经济和环境效益。