Smart power management: integrated circuits and system solutions
Smart power management: integrated circuits and system solutions
批准号:
376275-2009
负责人:
Trescases, Olivier
金额:
$2.11万
依托单位:
依托单位国家:
加拿大
项目类别:
Discovery Grants Program - Individual
财政年份:
2010
资助国家:
加拿大
项目状态:
已结题
起止时间:
2010-01-01 至 2011-12-31
中文摘要
近年来,随着微电子行业努力保持在摩尔定律预测的指数增长轨道上,能源效率和电源管理已成为中心舞台。开关模式电源(SMPS)是高效提供当今现代混合信号(数字+模拟)集成电路(IC)所需的严格控制的电源电压的关键使能技术。SMPS充当能源(如电池)和负载IC之间的接口。典型的开关电源使用高质量的半导体开关、储能元件、传感器和控制电路的组合来在存在干扰的情况下调节一个或多个输出电压。最先进的开关电源具有90%以上的功率转换效率。由此产生的低散热允许将多个SMP与其负载电路集成到单个IC中。开关电源研究的一个明显趋势是向数字控制回路、增加片上系统(SoC)应用的集成度、在全负载范围内更高的效率和更高的开关频率,从而导致更小的储能元件。拟议研究的长期目标是使未来的集成电源更智能、更小、更高效、更坚固和更可靠,同时减少电磁干扰(EMI)和对环境的影响。这项工作将专注于具有特别严格的可靠性标准的高压应用,在这些应用中,系统故障会给人类带来可怕的后果。这些应用包括汽车、航空航天、生物医学和工业应用。在这些应用中,例如发动机管理或安全气囊的汽车控制单元,多个电源在苛刻的环境条件下运行,这推动了硅技术的极限。因此,开发未来的汽车SoC需要专门的高压技术和电路。短期研究将集中在电路级功率级效率优化、先进封装和混合集成技术以及系统级创新。
英文摘要
In recent years, as the microelectronics industry struggles to stay on the path of exponential growth projected by Moore's law, energy efficiency and power-management have taken center stage. Switched-mode power supplies (SMPS) are the key enabling technology for efficiently delivering the tightly regulated supply voltages required by today's modern mixed-signal (digital+analog) integrated circuits (ICs). The SMPS acts as the interface between the energy source, such as a battery, and the load ICs. A typical SMPS uses a combination of high-quality semiconductor switches, energy storage components, sensors and control circuits to regulate one or more output voltages in the presence of disturbances. State-of-the-art SMPS have a power conversion efficiency above 90%. The resulting low heat dissipation allows multiple SMPS to be integrated with their load circuits into a single IC. The clear trend in SMPS research is toward digital control-loops, increased integration within system-on-chip (SoC) applications, higher efficiency over the full load-range and higher switching frequency, resulting in smaller energy storage components. The long-term goals of the proposed research are to make tomorrow's integrated power-supplies smarter, smaller, more efficient, more robust, and more reliable, while reducing electromagnetic interference (EMI) and environment impacts. This work will focus on high-voltage applications with particularly strict reliability standards, where system failure results in dire consequences to humans. These include automotive, aerospace, biomedical and industrial applications. In these applications, such as automotive control units for engine management or airbags, multiple power-supplies operate in harsh environmental conditions that push the limits of silicon technology. Accordingly, specialized high-voltage technologies and circuits are needed to develop tomorrow's automotive SoCs. The short-term research will be focused on circuit-level power-stage efficiency optimization, advanced packaging and hybrid-integration technologies, as well as system-level innovations.
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