Novel methodologies for fast electromagnetic modeling of signal propagation on interconnects

互连信号传播快速电磁建模的新方法

• 批准号: 312559-2010
• 负责人: Okhmatovski, Vladimir
• 金额: $ 1.46万
• 依托单位: University of Manitoba
• 依托单位国家: 加拿大
• 项目类别: Discovery Grants Program - Individual
• 财政年份: 2011
• 资助国家: 加拿大
• 起止时间: 2011-01-01 至 2012-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=481331
• 关键词: Novel; methodologies; fast; electromagnetic; modeling

The continuously increasing demand for higher functionality and lower cost of consumer and industrial electronics stipulates the evolution in microsystem design methodologies. As microsystem designs are exhibiting higher data exchange rates and tighter component integration, the modeling techniques must be changed adequately to account for the occurrence of tighter physical coupling between the devices. Thus, the large fragments of the microsystem designs must be modeled simultaneously while maintaining the electromagnetic accuracy of analysis. To overcome the constraints imposed on the analysis by the use of simplified traditional approaches capable of modelling only small microsystem fragments, we propose to develop a new generation of prototyping methodologies which can expediently handle the associated computational complexity. These methodologies will adapts today's fastest methods of computational electromagnetics to modeling of integrated electronics and map them onto powerful high-performance supercomputing architechtures. The main thrust of research will be in generalizing the recently proposed well-conditioned integral formulation to the case of multilayered substrates, augmenting them with skin-effect inclusive current flow models, and porting thus created algorithmic framework to the multiprocessor machines. This specialized software-hardware synergy will allow electronics designers to conduct electromagnetic modeling of integrated circuts of unprecedented sizes and complexity. Such modeling methods are expected to be adopted by the electronic design automation industry and establish a new standard as the available commercial tools greatly lack the capicity to address the associated complexity. The proposed research program will help close the gap between the needs and capabilities of electronics designers and has a potential to cut the multi-billion dollar losses incured by the majority of today's design houses and semiconductor foundries due to costly re-designs and delayed time-to-market.

消费者和工业电子产品对更高功能和更低成本的需求不断增加，这决定了微系统设计方法的发展。由于微系统设计显示出更高的数据交换速率和更紧密的组件集成，因此必须充分改变建模技术，以考虑设备之间更紧密的物理耦合的发生。因此，微系统设计的大片段必须同时建模，同时保持分析的电磁精度。为了克服使用简化的传统方法对分析施加的限制，这些方法只能对小的微系统片段进行建模，我们建议开发新一代的原型方法，可以方便地处理相关的计算复杂性。这些方法将采用当今最快的计算电磁学方法对集成电子学进行建模，并将其映射到强大的高性能超级计算架构上。研究的重点将是将最近提出的良好条件积分公式推广到多层基板的情况下，用皮肤效应包括电流模型来增强它们，并将由此创建的算法框架移植到多处理器机器上。这种专门的软件-硬件协同作用将允许电子设计人员对前所未有的尺寸和复杂性的集成电路进行电磁建模。这种建模方法有望被电子设计自动化行业采用，并建立一个新的标准，因为现有的商业工具严重缺乏处理相关复杂性的能力。拟议的研究计划将有助于缩小电子设计人员的需求和能力之间的差距，并有可能减少当今大多数设计公司和半导体代工厂因昂贵的重新设计和延迟上市时间而造成的数十亿美元损失。