Models for thermal contact resistance metal polymer interface models for friction and heat transfer for microchannels

热接触电阻模型 微通道摩擦和传热金属聚合物界面模型

• 批准号: 7445-2010
• 负责人: Yovanovich, Milan
• 金额: $ 1.75万
• 依托单位: University of Waterloo
• 依托单位国家: 加拿大
• 项目类别: Discovery Grants Program - Individual
• 财政年份: 2013
• 资助国家: 加拿大
• 起止时间: 2013-01-01 至 2014-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=521010
• 关键词: Models; thermal; contact; resistance; metal

Advances in functionality, speed, and performance of all microelectronic devices such as cell phones, notebooks, and high end servers have resulted in significant increases in heat which is produced at the device level. The heat must cross many interfaces formed by different materials (e.g. metal/metal, metal/polymer, polymer/polymer) before it is dissipated into the ambient through heat sinks. To ensure continuous functionality, the temperature of the devices must be maintained below certain critical levels. This requires the overall thermal resistance from the device to the ambient to be reduced and maintained at low levels over long periods of time. The overall resistance consists of several spreading-constriction and contact resistances in series arrangement. The thermal resistance of the heat sink is an important part of the overall resistance budget. Experimental research is being done to reduce the thermal resistance and the pressure drop of heat sinks by novel designs, and the use of new materials and cooling fluids. It is proposed to replace the conventional heat sinks with a system of microchannels of noncircular cross section such as trapezoidal or double trapezoidal which are etched into silicon. The hydraulic diameter of the microchannels is about 100 micrometers and the length may be several millimeters. Preliminary experimental results for microchannels show that they can outperform pin fin heat sinks by a factor of 2-3. However, little is known about the underlying transport mechanisms and whether the friction and heat transfer correlation equations developed for macrochannels are applicable for microchannels. All Canadian microelectronics companies are facing these severe thermal and hydraulic problems. The proposed experimental and modeling research has two parts: 1) Research on thermal spreading and contact resistances with different metal/polymer interfaces will yield accurate data, correlations and models for predicting the interface resistances. The data and correlations can be used by industries to rank the polymers. 2) Research on fluid flow and heat transfer in microchannels will produce thermofluids models and correlations to predict friction factor, pressure drop, and heat transfer correlations.

所有微电子设备（如手机、笔记本电脑和高端服务器）的功能、速度和性能的进步导致设备级产生的热量显著增加。热量必须穿过由不同材料（例如金属/金属、金属/聚合物、聚合物/聚合物）形成的许多界面，然后才能通过散热器消散到周围环境中。为了确保持续的功能，设备的温度必须保持在一定的临界水平以下。这就需要降低器件到环境的总热阻，并在长时间内保持在低水平。总电阻由多个串联排列的扩散-收缩电阻和接触电阻组成。散热器的热阻是总电阻预算的重要组成部分。正在进行实验研究，以通过新颖的设计以及使用新材料和冷却液来减少散热器的热阻和压降。提出用蚀刻到硅中的非圆形横截面（例如梯形或双梯形）的微通道系统代替常规的散热器。微通道的水力直径为约100微米，长度可以为几毫米。微通道的初步实验结果表明，它们可以超过针翅散热器的2-3倍。然而，鲜为人知的是基本的运输机制，以及是否摩擦和传热相关方程开发的宏通道是适用于微通道。所有加拿大微电子公司都面临着这些严重的热和液压问题。 本文的实验和建模研究主要分为两个部分：1）研究不同金属/聚合物界面的热扩散和接触电阻，可以获得准确的数据、关联式和模型，用于预测界面电阻。这些数据和相关性可以被工业用来对聚合物进行排名。2)对微通道内流体流动和传热的研究将产生热流体模型和关联式，以预测摩擦因数、压降和传热关联式。