MM-wave active antennas for communications applications

用于通信应用的毫米波有源天线

• 批准号: 155339-2009
• 负责人: Roy, Langis
• 金额: $ 2.19万
• 依托单位: Carleton University
• 依托单位国家: 加拿大
• 项目类别: Discovery Grants Program - Individual
• 财政年份: 2013
• 资助国家: 加拿大
• 起止时间: 2013-01-01 至 2014-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=522599
• 关键词: MM; wave; active; antennas; communications

The wireless industry continues to push for higher speed transmission, lower product size and cost, and greater product functionality. At the same time, increasing demands are placed on wireless devices, which are expected to be aware of their radio-wave environment and adapt to it in terms of operating frequencies, power levels and radiation characteristics. Such requirements, coupled with the realities of high-volume commercial applications, translate into several component-level technological challenges that today are barely being met: frequency-agile or multiband RF circuits and antennas, increased integration levels of RF transceivers and antennas at limited cost/performance degradations, acceptable DC/RF conversion and operating efficiencies, to name only a few. These difficulties are severely compounded when operating frequencies move toward the mm-wave band, as they eventually must to avoid spectrum crowding and to permit emerging applications such as short-range multi-Gbps wireless links (i.e. 60 GHz and above). A number of exciting new materials and RF technologies appear promising, at least individually: nanometric (65 nm, 45 nm) CMOS for low-power active circuitry, GaN HEMT for high-efficiency power stages, liquid-crystal polymer (LCP) and low-temperature co-fired ceramic (LTCC) substrates for passives, antennas and packaging. This work focuses on active antennas that intimately combine these and other active, passive and packaging components with novel radiating structures. The proposed research addresses in several ways the major challenges associated with the development of next generation mm-wave wireless communicators.

无线行业继续推动更高的传输速度、更低的产品尺寸和成本以及更强大的产品功能。与此同时，对无线设备的要求也越来越高，这些设备应了解其无线电波环境，并在工作频率、功率水平和辐射特性方面与之相适应。这些要求，加上大量商业应用的现实，转化为几个组件级别的技术挑战，今天几乎没有得到满足：频率捷变或多频段射频电路和天线，以有限的成本/性能降级提高射频收发器和天线的集成度，可接受的DC/RF转换和运行效率，仅举几例。当工作频率向毫米波频段移动时，这些困难会严重加剧，因为它们最终必须避免频谱拥挤，并允许新兴应用，如短距离多Gbps无线链路(即60 GHz及以上)。许多令人振奋的新材料和射频技术至少在个别方面看起来很有前途：用于低功率有源电路的纳米(65 nm，45 nm)CMOS，用于高效率功率级的GaN HEMT，用于无源、天线和封装的液晶聚合物(LCP)和低温共烧陶瓷(LTCC)基板。这项工作的重点是有源天线，它将这些和其他有源、无源和封装组件与新颖的辐射结构紧密结合。拟议的研究以几种方式解决了与开发下一代毫米波无线通信器相关的主要挑战。