Micro electroforming and ultra micro fabrication of components with modern electroplating alloying techniques.

采用现代电镀合金技术对组件进行微电铸和超微制造。

• 批准号: 451458-2013
• 负责人: Schlesinger, Mordechay
• 金额: $ 1.82万
• 依托单位: University of Windsor
• 依托单位国家: 加拿大
• 项目类别: Engage Grants Program
• 财政年份: 2013
• 资助国家: 加拿大
• 起止时间: 2013-01-01 至 2014-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=540309
• 关键词: Micro; electroforming; ultra; micro; fabrication

In order to have desirable function and meet consumer expectation modern electroplating techniques must be made part and parcel of SHIMIFREZ's production tools. It should be remembered that what the company is marketing are parts and devices produced through micro electroforming and ultra microfabrication. To expand the circle of devices that meet present day consumer expectations, devices will have to contain, nay made of and plated by novel materials which hitherto are not immediately available. The goal of the project is to combine the company expertise in device making with that of an expert of the University of Windsor in the creation and deposition of the most novel and up to date alloyed material.

为了具有理想的功能和满足消费者的期望，现代电镀技术必须成为SHIMIFREZ生产工具的重要组成部分。应该记住的是，该公司营销的是通过微电铸和超微加工生产的零部件和设备。为了扩大满足当今消费者期望的设备的范围，设备将必须包含迄今为止无法立即获得的新型材料。该项目的目标是将公司在设备制造方面的专业知识与温莎大学一位专家在创造和沉积最新颖和最新的合金材料方面的专业知识结合起来。