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Mechanical fatigue of a lead-free solder alloy

Mechanical fatigue of a lead-free solder alloy
无铅焊料合金的机械疲劳
批准号：
474836-2014
负责人：
Weck, Arnaud
金额：
$1.82万
依托单位：
University of Ottawa
依托单位国家：
加拿大
项目类别：
Engage Grants Program
财政年份：
2014
资助国家：
加拿大
项目状态：
已结题
起止时间：
2014-01-01 至 2015-12-31
来源：
https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=565105
关键词：
Mechanicalfatigueleadfreesolder

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英文摘要
In microelectronic packages, solder joints ensure both electrical and mechanical connections between the printed circuit board (PCB) and the chip. During in service use, local operating temperatures increase and decrease repeatedly, exposing components of the package to thermo-mechanical strains arising from different coefficients of thermal expansion of the materials involved including the solder joints. These cyclic mechanical strains in the solder lead to thermo-mechanical fatigue crack initiation and propagation that can lead to solder joint failure. In addition to thermomechanical fatigue, solder joints can also be subjected to mechanical fatigue when the board or substrate is bent during mechanical handling or from vibration forces.
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  • 批准号：
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  • 项目类别：
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  • 资助金额：
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    University of Ottawa
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  • 批准号：
    RGPIN-2019-05263
  • 项目类别：
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  • 资助金额：
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    RGPIN-2019-05263
  • 项目类别：
    Discovery Grants Program - Individual
  • 资助金额：
    $2.04万
  • 财政年份：
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