Infrared imager

该项目旨在开发高性能红外传感器的成本效益批量制造和包装的使能技术。虽然红外成像在历史上是为军事应用而开发的，但现在最大的增长机会是在商业市场。非制冷红外成像系统的市场目前估计为35万台，预计到2016年将增长到近120万台。红外成像技术在环境监测、热成像、过程控制、工业设备检测和维护等领域有着广泛的应用，被认为是一项重要的绿色技术。商业视觉应用包括监控、汽车和海事安全以及消防。拟议的项目为加拿大提供了一个重要机会，使其能够为这些在全世界日益重要的领域作出贡献。 在这个项目中解决的主要技术障碍包括开发晶圆级真空封装，低温3D集成与电子，高品质温度敏感薄膜结构的成本效益沉积，和多物理建模。我们组建了一支由大学研究人员和行业开发人员组成的优秀团队。利用合作大学的资源，舍布鲁克大学和蒙特利尔理工学院，与工业合作伙伴Teledyne DALSA，SPTS Technology以及在Bromont（魁北克）新成立的MiQro创新合作中心（C2MI），我们将开发一种具有成本效益的晶圆级制造和封装高性能红外成像传感器的新方法。该项目不仅将利用C2MI的世界级设施开发红外传感器，还将提供广泛的新工艺和技术，特别是在3D半导体集成和封装的高需求领域。

This project aims to develop the enabling technologies for cost-effective batch fabrication and packaging of high-performance infrared sensors. Although infrared imaging was historically developed for military applications, the biggest opportunities for growth are now in commercial markets. The market for uncooled infrared imaging systems is currently estimated at 350 000 units and expected to grow to nearly 1.2 million units by 2016. Infrared imaging is recognized as an important green technology because of its numerous applications in environmental monitoring, thermography, process control, and inspection and maintenance of industrial equipment. Commercial vision applications include surveillance, automotive and maritime safety, and fire-fighting. The proposed project represents an important opportunity for Canada to contribute to these areas of growing importance worldwide. The main technical hurdles addressed in this project include the development wafer-level vacuum packaging, low-temperature 3D-integration with electronics, cost-efficient deposition of high quality temperature sensitive thin-film structures, and multi-physics modeling. We have assembled an outstanding team of university researchers and industry developers. Leveraging the resources of the partner universities, the Université de Sherbrooke and the École Polytechnique de Montréal, with industrial partners Teledyne DALSA, SPTS Technology, and the newly established MiQro Innovation Collaborative Center (C2MI) in Bromont (Québec), we will develop a novel approach for the cost-effective wafer-level fabrication and packaging of high-performance infrared imaging sensors. The proposed project will not only exploit the world-class facilities of C2MI for developing the infrared sensor, it will also contribute a wide range of new processes and know-how, notably in the high-demand areas of 3D semiconductor integration and packaging.