Multiscale thermal management of electronic components and enclosures

电子元件和外壳的多尺度热管理

• 批准号: 447483-2013
• 负责人: Groulx, Dominic
• 金额: $ 4.52万
• 依托单位: Dalhousie University
• 依托单位国家: 加拿大
• 项目类别: Collaborative Research and Development Grants
• 财政年份: 2015
• 资助国家: 加拿大
• 起止时间: 2015-01-01 至 2016-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=575318
• 关键词: Multiscale; thermal; management; electronic; components

Electronic components are today found in nearly every advanced engineering system. Thermal management of these electronics is becoming one of the most challenging issues in advanced systems engineering and an important subject in regard to overall systems performance. To complicate matter, these electronic systems vary in size from the millimeter for transistor packages to the ten of meter for independent, integrated electronics shelters. As a result of the multitude of scales, no "one size fits all" solution can be applied to solve this important issue; independent, system specific solutions must be researched and engineered. The objective of this four year research program is to develop thermal management solutions at various scales of electronic systems used by the industrial partner, and develop associated systems required for this thermal management, i.e., liquid cooling systems and pumps. The research will be performed at the applicant's Lab of Applied Multiphase Thermal Engineering (LAMTE) at Dalhousie University. Five high priority research projects were selected: i. Ruggedized Tesla Pump for Liquid Cooling in Adverse Conditions; ii. Gallium Nitride (GaN) Transistor Cooling Improvement Strategies; iii. Innovative Liquid Cooling Method of Enclosed Electronic Power Systems; iv. Thermal and Energy Management of Large Scale Electronic Shelters; v. Effects of Contact Surface Characteristics on Thermal Interface Materials (TIMs) Performance. In order to perform the research associated with these projects, and provide innovative solutions for the related thermal management issues, a combination of experimental, numerical and analytical work will be needed and performed. This proposed research will benefit both the industrial partner and the Canadian electronics industry by providing critical knowledge, methods and designs for increase thermal management of power electronics at various scale.

如今，几乎每个高级工程系统都发现了电子组件。热管理 这些电子产品正在成为高级系统工程中最具挑战性的问题之一， 关于整体系统性能的重要主题。使物质复杂化，这些电子系统 从晶体管包的毫米到毫米的大小各不相同 电子庇护所。由于众多量表的结果，没有“一个尺寸适合所有”解决方案可以应用于求解 这个重要的问题；必须研究和设计独立的系统特定解决方案。 这四年研究计划的目的是开发各种规模的热管理解决方案 工业合作伙伴使用的电子系统，并开发此热量所需的相关系统 管理，即液体冷却系统和泵。该研究将在申请人的实验室进行 达尔豪斯大学的应用多相热工程（LAKTE）。五项高优先研究 选择了项目：i。在不利条件下，坚固的特斯拉泵用于液体冷却； ii。镓 氮化物（GAN）晶体管冷却改进策略； iii。封闭的创新液体冷却方法 电子电力系统； iv。大规模电子庇护所的热和能量管理； v。效果 热接口材料（TIM）性能的接触表面特征。为了执行 与这些项目相关的研究，并为相关的热管理提供创新的解决方案 问题，将需要并进行实验，数值和分析工作的组合。 这项拟议的研究将使工业合作伙伴和加拿大电子行业受益 提供关键的知识，方法和设计，以增加电力电子的热管理 各种规模。