Multiscale thermal management of electronic components and enclosures

电子元件和外壳的多尺度热管理

• 批准号: 447483-2013
• 负责人: Groulx, Dominic
• 金额: $ 4.52万
• 依托单位: Dalhousie University
• 依托单位国家: 加拿大
• 项目类别: Collaborative Research and Development Grants
• 财政年份: 2015
• 资助国家: 加拿大
• 起止时间: 2015-01-01 至 2016-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=575318
• 关键词: Multiscale; thermal; management; electronic; components

Electronic components are today found in nearly every advanced engineering system. Thermal management of these electronics is becoming one of the most challenging issues in advanced systems engineering and an important subject in regard to overall systems performance. To complicate matter, these electronic systems vary in size from the millimeter for transistor packages to the ten of meter for independent, integrated electronics shelters. As a result of the multitude of scales, no "one size fits all" solution can be applied to solve this important issue; independent, system specific solutions must be researched and engineered. The objective of this four year research program is to develop thermal management solutions at various scales of electronic systems used by the industrial partner, and develop associated systems required for this thermal management, i.e., liquid cooling systems and pumps. The research will be performed at the applicant's Lab of Applied Multiphase Thermal Engineering (LAMTE) at Dalhousie University. Five high priority research projects were selected: i. Ruggedized Tesla Pump for Liquid Cooling in Adverse Conditions; ii. Gallium Nitride (GaN) Transistor Cooling Improvement Strategies; iii. Innovative Liquid Cooling Method of Enclosed Electronic Power Systems; iv. Thermal and Energy Management of Large Scale Electronic Shelters; v. Effects of Contact Surface Characteristics on Thermal Interface Materials (TIMs) Performance. In order to perform the research associated with these projects, and provide innovative solutions for the related thermal management issues, a combination of experimental, numerical and analytical work will be needed and performed. This proposed research will benefit both the industrial partner and the Canadian electronics industry by providing critical knowledge, methods and designs for increase thermal management of power electronics at various scale.

如今，几乎所有先进的工程系统中都可以找到电子元件。的热管理 这些电子学正在成为先进系统工程中最具挑战性的问题之一， 这是整个系统性能方面的重要问题。更复杂的是，这些电子系统 尺寸从晶体管封装的毫米到独立、集成 电子避难所由于尺度众多，没有“一刀切”的解决方案可以应用于解决 必须研究和设计独立的系统特定解决方案。 这个为期四年的研究计划的目标是开发各种规模的热管理解决方案 工业合作伙伴使用的电子系统，并开发此热 管理，即，液体冷却系统和泵。研究将在申请人的实验室进行， 应用多相热工程（LAMTE）在达尔豪西大学。五项优先研究 选定的项目：一。用于恶劣条件下液体冷却的加固特斯拉泵; ii.镓 氮化物（GaN）晶体管冷却改进策略; iii.创新的封闭式液体冷却方法 电力系统; iv.大规模电子掩体的热量和能量管理; v.影响 接触表面特性对热界面材料（TIM）性能的影响。为了执行 与这些项目相关的研究，并为相关的热管理提供创新的解决方案 因此，需要并执行实验、数值和分析工作相结合的工作。 这项拟议的研究将有利于工业合作伙伴和加拿大电子工业， 提供关键的知识，方法和设计，以提高电力电子设备的热管理， 各种规模。