Modelling of environmental effects on silicon dangling bond quantum cellular automata circuits and development of simulation tools

Quantum Silicon Inc.成立于2011年，位于加拿大埃德蒙顿。(QSI)是世界上第一个 基于硅悬挂键技术的量子点计算设备的开发者。这些设备 在原子尺度上操作，而没有基于CMOS的电子器件的常规电流消耗，从而 提供了比工业标准计算设备更高速度和更低功耗的优点。 采用量子点来扩展计算能力的不同方法超出了 在过去的20年里，CMOS制造工艺已经得到了改进，但QSI的技术是独一无二的， 采用H-Si（001）表面上的硅悬挂键作为量子点。在这样做时，精确 这种点的组件可以被创建以形成执行二进制功能的复杂电路， 众所周知的量子点元胞自动机（QCA）计算方案。到目前为止，广泛的研究已经 设计各种各样的QCA电路，而没有合适的制造方法。QSI技术 从而为实现QCA电路和利用电路设计CAD提供了新的潜力 已经开发的工具。 针对这种情况，对现有的QCA CAD工具进行了改进和泰勒化， 对QSI悬挂键技术的研究，对QSI的设计和调试具有重要意义。目前， 模拟QCA电路行为的方法很少考虑环境的影响（退相干） 在电路上的操作由特定的物理实现强加，而是倾向于使粗糙 一般热效应的近似值，或者一起忽略它们。因此，在硅的情况下 悬挂键技术，目前还没有分析硅悬挂之间的热相互作用 键合量子点及其硅晶格衬底影响电路性能。该项目旨在 开发这些模型并将其整合到CAD工具QCADesigner中，使QSI工程师能够更好地 了解电路级行为。

Founded in 2011 and located in Edmonton Canada, Quantum Silicon Inc. (QSI) is the world's first commercial developer of quantum-dot computing devices based on silicon dangling bond technology. These devices operate at an atomic scale without the conventional current consumption of CMOS-based electronics, thereby offering advantages of higher speed and lower power consumptions than industry standard computing devices. Different methods of employing quantum dots to extend computational abilities beyond the limits imposed by CMOS fabrication processes have been refined over the past 2 decades, but QSI's technology is unique in that it employs silicon dangling bonds on a H-Si(001) surface to act as the quantum dots. In so doing, precise assemblies of such dots can be created to form complex circuits that perform binary functions by employing the well known quantum dot cellular automata (QCA) computing scheme. To date, extensive research has gone into designing a wide variety of QCA circuits without a suitable means of fabrication. QSI's technology therefore offers all new potential to realize QCA circuits and take practical advantage of circuit design CAD tools that have already been developed. In light of this situation, modification and taylorization of current QCA CAD tools to simulating circuits based on QSI's dangling bond technology is important for purposes of designing and debugging. At the moment, methods of simulating QCA circuit behaviour rarely account for the effects of the environment (decoherence) on circuit operation imposed by a specific physical implementation, but instead tend to make rough approximations of generic thermal effects or ignore them all together. Therefore, in the case of silicon dangling bond technology, there is no existing analysis of how thermal interaction between silicon dangling bond quantum dots and their silicon lattice substrate influences circuit performance. This project aims to develop these models and incorporate them into the CAD tool QCADesigner allowing QSI engineers to better understand the circuit level behavior.