Enhanced thermal transport mechanism for natural convection heat sinks

点击翻译按钮获取中文摘要

The power output of Information and Communications Technology (ICT) is ever increasing resulting in greater heat loads and increased reliability issues in vital electronics components. The problem with current ICT heat sinks is that single phase thermal management strategies have attained their upper threshold in transport capabilities due to the limited cooling capacity of air-cooled heat sinks. Indeed, this proposal's industry partner Alcatel-Lucent Canada, relies on single phase thermal management strategies for its Remote Radio Heads by increasing the size of the devices' heat sinks to match the increasing heat loads. This solution however results in an adverse size and weight to the apparatus which is not desired for their remote ICT devices. The present proposal puts forth the first phase in a heat management strategy which aims to develop a highly effective two-phase thermal system designed to handle the heat loads of ICT devices. A second phase into the viability of this thermal management strategy will be the subject of a future Engage plus application. The motivation for this project is to increase the reliability of ICT components and to reduce overall heat sink size and weight.