Computer aided design tools for photonic integrated circuits

光子集成电路计算机辅助设计工具

• 批准号: 493622-2016
• 负责人: Smy, Tom
• 金额: $ 3.64万
• 依托单位: Carleton University
• 依托单位国家: 加拿大
• 项目类别: Collaborative Research and Development Grants
• 财政年份: 2017
• 资助国家: 加拿大
• 起止时间: 2017-01-01 至 2018-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=618662
• 关键词: Computer; aided; design; tools; photonic

Optical technologies for a wide variety of applications appear to be approaching a critical point in development. The improvement of planar optical technologies utilizing integrated electronics fabrication techniques has lead to various initiatives in the development of Photonic Integrated Circuits (PIC). The combination of the physical complexity present in the operation of PIC and a wide range of applications require the creation of a CAD infrastructure comparable at least in effectiveness as developed for electronics. Additional complexity arises from coupled optical and thermal phenomena and the strong geometrical dependance of optical components. A wide range of possible applications from telecommunications and microwave photonics to sensors will require a powerful and flexible set of CAD tools.This grant will undertake to develop simulation techniques and practices to integrate and extend two of the applicants previously developed simulation tools. The first is a mixed domain circuit simulator (OptiSPICE) for use as a primary design tool for PIC created using photonic toolkits. Previous work has shown OptiSPICE to be a very appropriate tool for time-domain circuit level simulation of small to medium sized circuits. The second Atar is 3D thermal modeling and simulation framework. The applicant has also presented work demonstrating the use of powerful model reduction techniques for building small thermal models of optical devices that can be easily used in OptiSPICE. This previous work plus new initiatives on incorporating additional simulation methodologies, methods of creating flexible models for component libraries and layout/technology driven thermal models will enable the creation of powerful CAD tool for PIC design. A key point will be the need for a close connection between circuit layout, model creating and parameterization, thermal modeling and circuit design.

各种应用的光学技术似乎正在接近发展的临界点。利用集成电子制造技术的平面光学技术的改进导致了光子集成电路（PIC）发展中的各种举措。PIC操作中存在的物理复杂性和广泛的应用的组合需要创建至少在有效性上与为电子器件开发的CAD基础设施相当的CAD基础设施。额外的复杂性来自耦合的光学和热现象以及光学元件的强几何依赖性。从电信和微波光子学到传感器的广泛应用将需要一套强大而灵活的CAD工具。该资助将用于开发模拟技术和实践，以整合和扩展申请人以前开发的两种模拟工具。第一个是混合域电路模拟器（OptiSPICE），用作使用光子工具包创建的PIC的主要设计工具。以前的工作已经表明OptiSPICE是一个非常合适的工具，时域电路级仿真的中小型电路。第二个Atar是三维热建模和仿真框架。申请人还展示了使用强大的模型简化技术来构建光学器件的小型热模型的工作，这些模型可以很容易地用于OptiSPICE。这一先前的工作加上新的举措，包括额外的模拟方法，为组件库创建灵活模型的方法，以及布局/技术驱动的热模型，将能够为PIC设计创建功能强大的CAD工具。一个关键点将是电路布局，模型创建和参数化，热建模和电路设计之间的紧密联系的需要。