课题基金 / 基金详情

Computer aided design tools for photonic integrated circuits

Computer aided design tools for photonic integrated circuits
光子集成电路计算机辅助设计工具
批准号:
493622-2016
负责人:
Smy, Tom
金额:
$3.64万
依托单位:
依托单位国家:
加拿大
项目类别:
Collaborative Research and Development Grants
财政年份:
2017
资助国家:
加拿大
项目状态:
已结题
起止时间:
2017-01-01 至 2018-12-31

项目摘要

项目成果

Smy, Tom的其他基金

相似基金

相关文献

中文摘要
翻译
点击翻译按钮获取中文摘要
英文摘要
Optical technologies for a wide variety of applications appear to be approaching a critical point in development. The improvement of planar optical technologies utilizing integrated electronics fabrication techniques has lead to various initiatives in the development of Photonic Integrated Circuits (PIC). The combination of the physical complexity present in the operation of PIC and a wide range of applications require the creation of a CAD infrastructure comparable at least in effectiveness as developed for electronics. Additional complexity arises from coupled optical and thermal phenomena and the strong geometrical dependance of optical components. A wide range of possible applications from telecommunications and microwave photonics to sensors will require a powerful and flexible set of CAD tools.This grant will undertake to develop simulation techniques and practices to integrate and extend two of the applicants previously developed simulation tools. The first is a mixed domain circuit simulator (OptiSPICE) for use as a primary design tool for PIC created using photonic toolkits. Previous work has shown OptiSPICE to be a very appropriate tool for time-domain circuit level simulation of small to medium sized circuits. The second Atar is 3D thermal modeling and simulation framework. The applicant has also presented work demonstrating the use of powerful model reduction techniques for building small thermal models of optical devices that can be easily used in OptiSPICE. This previous work plus new initiatives on incorporating additional simulation methodologies, methods of creating flexible models for component libraries and layout/technology driven thermal models will enable the creation of powerful CAD tool for PIC design. A key point will be the need for a close connection between circuit layout, model creating and parameterization, thermal modeling and circuit design.
期刊论文(0)
专著(0)
科研奖励(0)
会议论文
Multi-physics Simulation and Modelling of Metasurfaces for Communications and Sensor Applications from Device to System
  • 批准号:
    RGPIN-2019-06315
  • 项目类别:
    Discovery Grants Program - Individual
  • 资助金额:
    $2.04万
  • 财政年份:
    2022
  • 负责人:
    Smy, Tom
  • 依托单位:
Multi-physics Simulation and Modelling of Metasurfaces for Communications and Sensor Applications from Device to System
  • 批准号:
    RGPIN-2019-06315
  • 项目类别:
    Discovery Grants Program - Individual
  • 资助金额:
    $2.04万
  • 财政年份:
    2021
  • 负责人:
    Smy, Tom
  • 依托单位:
Multi-physics Simulation and Modelling of Metasurfaces for Communications and Sensor Applications from Device to System
  • 批准号:
    RGPIN-2019-06315
  • 项目类别:
    Discovery Grants Program - Individual
  • 资助金额:
    $2.04万
  • 财政年份:
    2020
  • 负责人:
    Smy, Tom
  • 依托单位:
Multi-physics Simulation and Modelling of Metasurfaces for Communications and Sensor Applications from Device to System
  • 批准号:
    RGPIN-2019-06315
  • 项目类别:
    Discovery Grants Program - Individual
  • 资助金额:
    $2.04万
  • 财政年份:
    2019
  • 负责人:
    Smy, Tom
  • 依托单位:
国内基金
海外基金
基于磷酸二酯酶IV结构的抑制剂的设计与动态组合合成
  • 批准号:
    30500633
  • 项目类别:
    青年科学基金项目
  • 资助金额:
    26.0万元
  • 批准年份:
    2005
  • 负责人:
    郭彦伸
  • 依托单位: