Novel packaging concepts for ultra high-speed digital communication modules

超高速数字通信模块的新颖封装概念

• 批准号: 513484-2017
• 负责人: Kouki, Ammar
• 金额: $ 1.82万
• 依托单位: École de technologie supérieure
• 依托单位国家: 加拿大
• 项目类别: Engage Grants Program
• 财政年份: 2017
• 资助国家: 加拿大
• 起止时间: 2017-01-01 至 2018-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=639567
• 关键词: Novel; packaging; concepts; ultra; speed

To meet the ever-growing need for more data speeds that are needed today everyday life and for most economicactivities, higher speed opto-electronic communication circuits that provide larger bandwidths are required.One of the challenges of developing such circuits is how to package them in small size packages that are bothenergy and cost efficient. One of the key enabling technologies in this area is the ceramic technology known asLTCC (Low Temperature Cofired Ceramics) which allows designers to build 3D packages that can meetstringent performance requirements at very high frequencies. This technology is available at our LTCC@ÉTSlaboratory in École de technologie supérieure and the present projects aims to launch a collaboration betweenour Laboratory and SANMINA, a leader in the design and manufacturing of advanced optical andmicro-electronic modules for various industries, whereby this technology will be used to design and validatenew packaging concepts for high-speed opto-electronic modules.

为了满足当今日常生活和大多数经济活动对更高数据速度的不断增长的需求，需要提供更大带宽的更高速度的光电通信电路。开发这种电路的挑战之一是如何将它们封装在既节能又经济的小尺寸封装中。该领域的关键使能技术之一是被称为ltcc（低温共烧陶瓷）的陶瓷技术，该技术允许设计人员构建能够在非常高的频率下满足严格性能要求的3D封装。这项技术可在我们的LTCC@ÉTSlaboratory （École de technology supsamrieure）上获得，目前的项目旨在启动我们实验室与SANMINA之间的合作，SANMINA是设计和制造各种行业先进光学和微电子模块的领导者，该技术将用于设计和验证高速光电模块的新封装概念。