Novel packaging concepts for ultra high-speed digital communication modules

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To meet the ever-growing need for more data speeds that are needed today everyday life and for most economicactivities, higher speed opto-electronic communication circuits that provide larger bandwidths are required.One of the challenges of developing such circuits is how to package them in small size packages that are bothenergy and cost efficient. One of the key enabling technologies in this area is the ceramic technology known asLTCC (Low Temperature Cofired Ceramics) which allows designers to build 3D packages that can meetstringent performance requirements at very high frequencies. This technology is available at our LTCC@ÉTSlaboratory in École de technologie supérieure and the present projects aims to launch a collaboration betweenour Laboratory and SANMINA, a leader in the design and manufacturing of advanced optical andmicro-electronic modules for various industries, whereby this technology will be used to design and validatenew packaging concepts for high-speed opto-electronic modules.