Novel packaging concepts for ultra high-speed digital communication modules

超高速数字通信模块的新颖封装概念

• 批准号: 513484-2017
• 负责人: Kouki, Ammar
• 金额: $ 1.82万
• 依托单位: École de technologie supérieure
• 依托单位国家: 加拿大
• 项目类别: Engage Grants Program
• 财政年份: 2017
• 资助国家: 加拿大
• 起止时间: 2017-01-01 至 2018-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=639567
• 关键词: Novel; packaging; concepts; ultra; speed

To meet the ever-growing need for more data speeds that are needed today everyday life and for most economicactivities, higher speed opto-electronic communication circuits that provide larger bandwidths are required.One of the challenges of developing such circuits is how to package them in small size packages that are bothenergy and cost efficient. One of the key enabling technologies in this area is the ceramic technology known asLTCC (Low Temperature Cofired Ceramics) which allows designers to build 3D packages that can meetstringent performance requirements at very high frequencies. This technology is available at our LTCC@ÉTSlaboratory in École de technologie supérieure and the present projects aims to launch a collaboration betweenour Laboratory and SANMINA, a leader in the design and manufacturing of advanced optical andmicro-electronic modules for various industries, whereby this technology will be used to design and validatenew packaging concepts for high-speed opto-electronic modules.

为了满足日益增长的数据传输速度的需求，人们需要更高速度、更大带宽的光电子通信电路，而开发这种电路的挑战之一是如何将其封装在小尺寸封装中，既节省能源又节省成本。该领域的关键技术之一是称为LTCC（低温共烧陶瓷）的陶瓷技术，该技术允许设计人员构建能够在非常高的频率下满足严格性能要求的3D封装。该技术可在我们的LTCC@ ÉTS实验室在巴黎高等技术学校和目前的项目旨在启动我们的实验室和SANMINA，在先进的光学和微电子模块的设计和制造的领导者，为各行业之间的合作，从而该技术将被用于设计和验证新的封装概念的高速光电模块。