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Advanced Applications of Two-Dimensional Coupled Microring Resonator Networks

Advanced Applications of Two-Dimensional Coupled Microring Resonator Networks
二维耦合微环谐振网络的高级应用
批准号:
RGPIN-2016-05663
负责人:
Van, Vien
金额:
$2.62万
依托单位:
依托单位国家:
加拿大
项目类别:
Discovery Grants Program - Individual
财政年份:
2019
资助国家:
加拿大
项目状态:
已结题
起止时间:
2019-01-01 至 2020-12-31

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中文摘要
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英文摘要
The proposed research is in the area of integrated photonic devices, with focus on advanced applications of coupled microring resonators (CMRs) for optical communication and optical interconnect systems. Microring resonators are travelling-wave optical resonators which have become a key building block in many photonic integrated circuits, thanks to their compact sizes, versatility, and ease of fabrication and integration. One of the most important applications of microring resonators is the construction of high-order optical filters by coupling multiple resonators together. Conventional microring filters are based on the one-dimensional (1D) coupling topology, which can only realize a limited set of spectral responses. By extending the coupling topology to two dimensions (2D), much richer spectral characteristics can be synthesized for advanced applications in optical spectral engineering, such as high-performance filters and dispersion compensators.*** The objective of the research is to investigate and explore novel applications of a new type of 2D CMR networks, namely those with complex field coupling coefficients. In these devices power exchange between adjacent resonators takes place via both the magnitude and phase of the electromagnetic fields, giving rise to novel effects not present in conventional CMRs with real coupling coefficients. The research aims to develop theory and techniques for designing and realizing general 2D CMR networks with complex field couplings. Novel applications such as bandpass filters with built-in dispersion compensation for Wavelength Division Multiplexing (WDM) communication systems, and the emerging class of fabrication-tolerant topologically-protected photonic devices will be proposed and experimentally demonstrated in the silicon material. The latter devices are based on the concept of 2D topological insulators in electronic systems, with unique properties such as robustness against structural disorder making these devices highly tolerant to fabrication imperfections.*** In addition to advancements in the field of microring resonators, the research is also expected to contribute to the development of silicon integrated photonics technology. Silicon photonics is rapidly becoming the industry standard for manufacturing photonic integrated circuits, driven by the growing demand for low-cost and large-scale integrated optics components for WDM and optical interconnect applications. The proposed research provides excellent opportunities for training highly-qualified personnel (HQP) in both the theoretical and technological development of silicon photonics. It is expected that the expertise gained, intellectual property developed and HQP trained through the research program will help accelerate the development of silicon photonics industry in Canada, as well as the broader optics and telecommunication industries.**
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A Silicon Topological Photonic Platform for Photonic Integrated Circuits
  • 批准号:
    RGPIN-2022-03427
  • 项目类别:
    Discovery Grants Program - Individual
  • 资助金额:
    $2.4万
  • 财政年份:
    2022
  • 负责人:
    Van, Vien
  • 依托单位:
Advanced Applications of Two-Dimensional Coupled Microring Resonator Networks
  • 批准号:
    RGPIN-2016-05663
  • 项目类别:
    Discovery Grants Program - Individual
  • 资助金额:
    $2.62万
  • 财政年份:
    2021
  • 负责人:
    Van, Vien
  • 依托单位:
Advanced Applications of Two-Dimensional Coupled Microring Resonator Networks
  • 批准号:
    RGPIN-2016-05663
  • 项目类别:
    Discovery Grants Program - Individual
  • 资助金额:
    $2.62万
  • 财政年份:
    2020
  • 负责人:
    Van, Vien
  • 依托单位:
Development of flexible silicon photonic components for WDM optical networks
  • 批准号:
    508309-2016
  • 项目类别:
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  • 资助金额:
    $8.38万
  • 财政年份:
    2019
  • 负责人:
    Van, Vien
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