Developing a 3D Co-printing Technology for Fabrication of Monolithic Microelectromechanical Systems

开发用于制造整体微机电系统的 3D 共打印技术

• 批准号: RGPIN-2016-05198
• 负责人: Yang, Jun
• 金额: $ 4.23万
• 依托单位: University of Western Ontario
• 依托单位国家: 加拿大
• 项目类别: Discovery Grants Program - Individual
• 财政年份: 2019
• 资助国家: 加拿大
• 起止时间: 2019-01-01 至 2020-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=690764
• 关键词: Developing; 3D; Co; printing; Technology

Demands for Microelectromechanical Systems (MEMS) devices have been continuously increasing in both the traditional fields and emerging fields of applications such as Internet of Things (IoT), smart phones, electric vehicles, etc. The emerging fields of applications are driving new MEMS developments. Also driven by the fast changing market, the Rabrication processes based materials. It's highly desirable to develop more versatile and robust new technologies for fabrication of MEMS devices, more importantly, which should enable fabrication of more complex 3D MEMS devices and enable more material selections. *** ***The objective of this application is to develop a “free-form” 3D co-printing technology that offers new options for design, fabrication, assembly and packaging of monolithic MEMS devices, and offers more choices for the structural and functional materials of the devices. The long-term goals of this program are to develop a total solution based on the additive manufacturing concept for small to mid-scale productions of some types of MEMS devices, and to develop a new class of MEMS devices. ******The proposed program is also an excellent program for HQP training that provides opportunities for the young generation of engineers and scientists to learn and practice the leading-edge technologies in the emerging fields of advanced manufacturing and MEMS.

无论是在传统领域还是在物联网（IoT）、智能手机、电动汽车等新兴应用领域，对微机电系统（MEMS）器件的需求都在不断增长。新兴的应用领域正在推动新的MEMS发展。同样受到快速变化的市场的驱动，基于材料的加工过程。开发更通用和强大的MEMS器件制造新技术是非常可取的，更重要的是，这应该能够制造更复杂的3D MEMS器件并实现更多的材料选择。*** ***本应用的目标是开发一种“自由形式”的3D共打印技术，为单片MEMS器件的设计、制造、组装和封装提供新的选择，并为器件的结构和功能材料提供更多选择。该项目的长期目标是为某些类型的MEMS器件的中小型生产开发基于增材制造概念的整体解决方案，并开发新型MEMS器件。******该计划也是一个优秀的HQP培训计划，为年轻一代的工程师和科学家提供了在先进制造和MEMS新兴领域学习和实践前沿技术的机会。