Wideband circuits with high dynamic range for data communication

手持通信覆盖超过2亿人，将他们与全球经济中的社交网络、娱乐和商业交易连接起来。人们需要以Gbit/S数据传输速率进行更大、更可靠的连接，但当前的无线电收发信机无法处理所需的大量频段，也无法适应新的频谱分配。未来的第五代(5G)无线或物联网应用的蓬勃发展需要宽带(即宽带)技术。*该项目正在培训加拿大的高素质人才(HQP)，为下一代通信和传感应用开发具有高动态范围的宽带硅电路。硅芯片集成是面向大众市场的低成本便携式移动设备创新的一个公认的驱动力。在未来5年内，具有7纳米栅极的硅-CMOS技术预计将在单个芯片上集成约200亿个晶体管，使更高性能的宽带系统变得触手可及。申请者和他的研究小组成员开发的用于屏蔽片上无源组件的新技术允许射频(RF)电子设备以比当今电路更宽的动态范围和更低的功耗运行。在这个项目中，先进的无源元件被集成到标准的计算机辅助设计(CAD)工具中，使芯片上的宽带系统更便宜、更可靠和更小。该项目开发的硅基新型射频电路将使先进的无线基站更便宜、更广泛地使用，使向移动客户提供Gbit/S数据速率成为现实。改善电路的动态范围使便携设备更可靠，这意味着在上传或下载数据时更少的掉话或延迟。应用于光通信系统的高线性度宽带电路实现了为5G系统中的无线基站提供高效服务所需的TB/S(即1,000 Gbit/S)数据传输。*这些创新通过培训稀缺而有价值的HQP，加强了加拿大工业在日益依赖宽带通信技术的巨大全球市场中的地位。该研究项目建立在开发硅芯片技术和商业设计工具的基础上，因此在新的和现有的应用中具有非常高的工业应用潜力。

Handheld communication reaches more than 2B people, connecting them to social networks, entertainment, and business transactions across the global economy. There is demand for greater and more reliable connectivity at Gbit/s data transfer rates, but current radio transceivers cannot handle the large number of bands required, or adapt to new spectrum allocations. Wide bandwidth (i.e., wideband) technologies are required for the fifth-generation (5G) wireless or IoT applications of the future to flourish.***This project is training of highly-qualified personnel (HQP) in Canada to develop wideband silicon circuits with high dynamic range for the next generations of communication and sensing applications. Integration on silicon chips is a well-established driver of innovation in low-cost portable mobile devices for the mass market. Within the next 5 years, silicon-CMOS technologies with 7-nm gates are projected to integrate ~20 billion transistors onto a single chip, bringing wideband systems with higher performance within our reach. New technologies for shielding on-chip passive components developed by the applicant and members of his research group permit radio-frequency (RF) electronics to operate with wider dynamic range and at reduced power consumption than today's circuits. In this project, advanced passive components are integrated into standard computer-aided design (CAD) tools that enable wideband systems on a chip that are less expensive, more reliable and smaller. Novel RF circuits on silicon developed in the project will make advanced wireless basestations less expensive and more widely available, making the delivery of Gbit/s data rates to mobile customers a reality. Improving the dynamic range of circuits makes portable devices more reliable, meaning fewer dropped calls or delays when uploading or downloading data. High-linearity, wideband circuits applied to optical communication systems enable Tbit/s (i.e., 1,000 Gbit/s) data transfers that are needed to service wireless basestations in 5G systems efficiently.***These innovations strengthen the position of Canadian industry in a huge global market that is increasingly dependent on broadband communications technology by training scarce and valuable HQP. This research project has a very high potential for industrial take-up in new and existing applications, as it builds on developing silicon chip technologies and commercial design tools.