Wideband circuits with high dynamic range for data communication

手持通信覆盖超过20亿人，将他们连接到全球经济中的社交网络、娱乐和商业交易。人们需要以Gbit/s的数据传输速率实现更大、更可靠的连接，但目前的无线电收发器无法处理所需的大量频带，也无法适应新的频谱分配。宽带宽（即，宽带）技术是未来第五代（5G）无线或物联网应用蓬勃发展所必需的。*该项目是在加拿大培训高素质人员（HQP），为下一代通信和传感应用开发具有高动态范围的宽带硅电路。硅芯片上的集成是大众市场低成本便携式移动的设备创新的公认驱动力。在未来5年内，具有7纳米栅极的硅CMOS技术预计将在单个芯片上集成约200亿个晶体管，从而使宽带系统具有更高的性能。由申请人及其研究小组成员开发的用于屏蔽片上无源元件的新技术允许射频（RF）电子器件以比当今电路更宽的动态范围和更低的功耗工作。在这个项目中，先进的无源元件被集成到标准的计算机辅助设计（CAD）工具中，使宽带系统的芯片更便宜，更可靠，更小。该项目开发的新型硅基射频电路将使先进的无线基站更便宜，更广泛地使用，使向移动的客户提供Gbit/s数据速率成为现实。改善电路的动态范围使便携式设备更可靠，这意味着在上传或下载数据时更少的掉线或延迟。应用于光通信系统的高线性度宽带电路使Tbit/s（即，1，000 Gbit/s）数据传输，以有效地为5G系统中的无线基站提供服务。*这些创新通过培训稀缺而宝贵的HQP，加强了加拿大工业在日益依赖宽带通信技术的巨大全球市场中的地位。该研究项目在新的和现有的应用中具有很高的工业应用潜力，因为它建立在开发硅芯片技术和商业设计工具的基础上。

Handheld communication reaches more than 2B people, connecting them to social networks, entertainment, and business transactions across the global economy. There is demand for greater and more reliable connectivity at Gbit/s data transfer rates, but current radio transceivers cannot handle the large number of bands required, or adapt to new spectrum allocations. Wide bandwidth (i.e., wideband) technologies are required for the fifth-generation (5G) wireless or IoT applications of the future to flourish.***This project is training of highly-qualified personnel (HQP) in Canada to develop wideband silicon circuits with high dynamic range for the next generations of communication and sensing applications. Integration on silicon chips is a well-established driver of innovation in low-cost portable mobile devices for the mass market. Within the next 5 years, silicon-CMOS technologies with 7-nm gates are projected to integrate ~20 billion transistors onto a single chip, bringing wideband systems with higher performance within our reach. New technologies for shielding on-chip passive components developed by the applicant and members of his research group permit radio-frequency (RF) electronics to operate with wider dynamic range and at reduced power consumption than today's circuits. In this project, advanced passive components are integrated into standard computer-aided design (CAD) tools that enable wideband systems on a chip that are less expensive, more reliable and smaller. Novel RF circuits on silicon developed in the project will make advanced wireless basestations less expensive and more widely available, making the delivery of Gbit/s data rates to mobile customers a reality. Improving the dynamic range of circuits makes portable devices more reliable, meaning fewer dropped calls or delays when uploading or downloading data. High-linearity, wideband circuits applied to optical communication systems enable Tbit/s (i.e., 1,000 Gbit/s) data transfers that are needed to service wireless basestations in 5G systems efficiently.***These innovations strengthen the position of Canadian industry in a huge global market that is increasingly dependent on broadband communications technology by training scarce and valuable HQP. This research project has a very high potential for industrial take-up in new and existing applications, as it builds on developing silicon chip technologies and commercial design tools.