Optimization of next generation electroformed flex-tubings for hydraulic servo valves

这项合作研究和开发资助计划旨在大幅提高霍尼韦尔航空航天（Honeywell Aerospace）原型电液伺服阀（EHSV）关键部件的使用寿命。 由霍尼韦尔航空航天公司、霍尼韦尔发动机、系统和服务公司、爱德华王子岛斯莱蒙公园公司（霍尼韦尔P.E.I.）和STENTECH（密西索加）（StenTech），所提出的研究涉及在电铸的柔性金属管系统的顶部上电沉积多孔金属膜。 然后，将耐燃料的减振弹性体结合到孔结构中，以使通过该阀部件的振动传播最小化。 这项工作将需要深入研究电沉积各种多孔镍结构，筛选它们的强度和附着力，形成弹性体复合材料和筛选复合材料的振动阻尼行为。 性能最佳的结构将被纳入电铸钴镍管和相关的结构。 最终，该组件将在霍尼韦尔下一代EHSV的力矩电机中实现。 这种合作关系基于卡尔加里大学（U Calgary）Birss集团的金属电沉积专业知识，他们与霍尼韦尔的密切合作经验，以及StenTech为其电铸技术寻求新的潜在市场的意愿，以及第三方原始设备制造商（OEM）实施这种方法。 该提案涉及将产品推向市场的概念到实施战略。 因此，拟议的研究将为航空业提供一种具有成本效益和更耐用的EHSV。 通过这样做，该项目有可能将OEM制造带到加拿大，并且由于在EHSV市场的份额增加，这将增加霍尼韦尔P.E.I.对服务专业知识的需求。航空设施。 这两项成果都将支持加拿大的高科技工作，并直接影响加拿大公司的经济竞争力。

This Collaborative Research and Development Grant proposal addresses strategies to dramatically improve the service life of critical components within prototype Honeywell Aerospace (Honeywell) electro-hydraulic servo valves (EHSV). Supported strongly by Honeywell Aerospace, Honeywell Engines, Systems & Services, Slemon Park, Prince Edward Island (Honeywell P.E.I.) and STENTECH (Mississauga) (StenTech), the proposed research involves the electrodeposition of a porous metal film on top of an electroformed, flexible metal tubing system. A fuel tolerant, vibration damping elastomer would then be incorporated into the pore structure in order to minimize vibration propagation through this valve component. This work will require intensive research on electrodepositing a variety of porous nickel structures, screening them for strength and adhesion, forming elastomer composites and screening the composites for vibration damping behavior. Best performing structures would be incorporated into electroformed Co-Ni tubes and related structures. Ultimately, this component would be implemented within the torque motor of the next generation of Honeywell's EHSVs. This partnership is based on the metals electrodeposition expertise of the Birss group at the University of Calgary (U Calgary), their close collaborative experience with Honeywell, and the willingness of StenTech to seek new potential markets for their electroforming technology, and implementation of this approach by a third party original equipment manufacturer (OEM). This proposal addresses a concept-to-implementation strategy for bringing a product to market. The proposed research will therefore provide a cost effective and more durable EHSV for the aviation industry. By doing so, this project has the potential to bring OEM manufacturing to Canada, and because of an increased share in the EHSV market, this will increase the need for service expertise at the Honeywell P.E.I. aviation facility. Both of these outcomes will support high technology jobs in Canada and directly impact economic competitiveness for Canadian-based companies.