Low Temperature Interconnections for High Performance Heterogeneous Integration

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To continue to increase performance, reduce cost and increase ubiquity through miniaturization, the next generation of innovative microelectronics must rely on integrating many disparate but highly performing functions and components available today into compact yet functionally superior systems. In many cases, the optimal component is not compatible with traditional soldering processes that demand temperatures in excess of 250°C. The alternatives of selecting reduced performance and/or higher cost components with sufficient temperature resistance or accepting a degradation of the temperature sensitive component both leave opportunity on the table. This project therefore proposes research to explore and implement low temperature interconnection materials, structures and processes into microelectronic packaging and thus remove the barriers to the integration of cost sensitive microelectronic components in high performance systems. By collaborating with industrial partner and global leader in microelectronics, IBM Canada, the solutions derived from this research will be optimally developed for cost-effective, globally competitive microelectronics production. The project will also contribute to environmentally conscience manufacturing by reducing energy consumption and improving component re-use.