Gold Stud Bump Flip chip Attach for Silicon Photonics Packaging

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The object of this research project is to initiate an assessment of Au stud bump flip chip attach of siliconphotonic (SiP) chips for the packaging of photonics modules of interest to the industrial partner TeraXion.Employing its scientific and industrial knowledge and expertise in 'flip-chip' type bonding technology prevalentin microelectronics packaging, the research team will strive to determine how such technology could beimplemented seamlessly within the unique requirements of TeraXion's modules. The research activities willfirst comprise the development of a Au stud bump process for SiP chips, then an evaluation of availablebonding approaches with the goal to assess their compatibility with TeraXion's requirements, followed by anoptical test assessment to verify the effects of the bonding process on Teraxion's chip integrity. This will resultin a first proof of principle of Au stud bump flip chip attach for SiP assembly in order to validate the potentialto transition TeraXion's modules to flip chip technologies and evaluate the effectiveness of the bonding processand propose directions for future activity. The outcome of this project will be to provide TeraXion with anincreased knowledge of flip chip-compatible bonding options and a path to more thoroughly evaluate the mostpromising interconnection options for the packaging of TeraXion photonics modules.