Study of Flip Chip Bonding Techniques for Compatibility with Concentrated Photovoltaic (CPV) Cell Packaging

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The object of this research project is to initiate assessment of bonding options for the packaging of CPV devices of interest to the industrial partner OPSUN Technologies. Using its current knowledge base and experience in 'flip-chip' type bonding technology that is prevalent in microelectronics packaging, the research team will strive to determine how such technology might be adapted to the unique requirements of advanced CPV devices. The research activities will first comprise the evaluation of available bonding approaches with the goal to assess each approach's compatibility (wrt parameters and materials) with OPSUN's requirements, followed by the elaboration of an appropriate yet simple test vehicle design to validate bonding effectiveness. A first proof of principle fabrication of the test vehicle will be executed to simulate a selected bonding technique, with a primary intent to evaluate the effectiveness of the design and propose directions for future activity. The outcome of this project will be to provide OPSUN with an increased knowledge of CPV-compatible bonding options and a path to more thoroughly evaluate the most promising interconnection options for their CPV package solutions.