Study of Flip Chip Bonding Techniques for Compatibility with Concentrated Photovoltaic (CPV) Cell Packaging

倒装芯片接合技术与聚光光伏 (CPV) 电池封装兼容的研究

• 批准号: 477780-2015
• 负责人: Danovitch, David
• 金额: $ 1.82万
• 依托单位: Université de Sherbrooke
• 依托单位国家: 加拿大
• 项目类别: Engage Grants Program
• 财政年份: 2015
• 资助国家: 加拿大
• 起止时间: 2015-01-01 至 2016-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=579076
• 关键词: Study; Flip; Chip; Bonding; Techniques

The object of this research project is to initiate assessment of bonding options for the packaging of CPV devices of interest to the industrial partner OPSUN Technologies. Using its current knowledge base and experience in 'flip-chip' type bonding technology that is prevalent in microelectronics packaging, the research team will strive to determine how such technology might be adapted to the unique requirements of advanced CPV devices. The research activities will first comprise the evaluation of available bonding approaches with the goal to assess each approach's compatibility (wrt parameters and materials) with OPSUN's requirements, followed by the elaboration of an appropriate yet simple test vehicle design to validate bonding effectiveness. A first proof of principle fabrication of the test vehicle will be executed to simulate a selected bonding technique, with a primary intent to evaluate the effectiveness of the design and propose directions for future activity. The outcome of this project will be to provide OPSUN with an increased knowledge of CPV-compatible bonding options and a path to more thoroughly evaluate the most promising interconnection options for their CPV package solutions.

本研究项目的目的是开始评估的粘接选择包装的CPV 工业合作伙伴OPSUN Technologies感兴趣的设备。利用其现有的知识库， 在微电子封装中流行的“倒装芯片”型键合技术方面， 团队将努力确定如何使这种技术适应先进的独特要求， CPV设备。研究活动将首先包括评估可用的粘合方法， 目标是评估每种方法（wrt参数和材料）与OPSUN要求的兼容性， 随后是一个适当的，但简单的测试车辆设计，以验证粘接效果的阐述。 将执行测试车辆的第一次原理制造证明，以模拟选定的粘合 技术，主要目的是评估设计的有效性，并提出未来的方向 活动这一项目的成果将使OPSUN更多地了解 CPV兼容的键合选项和更全面评估最有前途的互连的途径 为他们的CPV包解决方案的选项。