Self-adaptive heat sink - I2I Phase I
自适应散热器-I2I第一阶段
基本信息
- 批准号:555821-2020
- 负责人:
- 金额:$ 9.11万
- 依托单位:
- 依托单位国家:加拿大
- 项目类别:Idea to Innovation
- 财政年份:2020
- 资助国家:加拿大
- 起止时间:2020-01-01 至 2021-12-31
- 项目状态:已结题
- 来源:
- 关键词:
项目摘要
To reduce the cooling power consumption and improve the reliability of microelectronics and electrical power systems, intelligent thermal management becomes necessary, especially considering that heat loads vary over time and across different components. To address this need, we have created a new approach for cooling that can minimise the coolant consumption while maintaining the temperature uniform, even under time-dependant and non-uniform heat load scenarios. Indeed, the internal geometry of a liquid-cooled heat sink is able to tailor the distribution of the heat extraction capacity to the local needs. It does so over large surfaces without sensors or external power, using the local heat to deform thermostatic fins and valves to locally adapt the thermal resistance and coolant flow rate, respectively. The goal is to bring this technology from TRL 4 to 6 to attract partner interest and pursue its development, for future licensing and commercialisation by the partner. The objectives of this project are to define the most promising device configurations for specific applications (data center cooling and power electronics cooling), demonstrate a 50% reduction in power consumption and 10°C reduction in temperature non-uniformity, and asses the reliability and operability limits.
为了降低冷却功耗并提高微电子和电力系统的可靠性,智能热管理变得非常必要,特别是考虑到热负载随时间和不同组件而变化。为了满足这一需求,我们创造了一种新的冷却方法,可以最大限度地减少冷却剂的消耗,同时保持温度均匀,即使在时间依赖性和不均匀的热负荷情况下。事实上,液体冷却散热器的内部几何形状能够根据当地需要调整热提取能力的分布。它在没有传感器或外部电源的情况下在大表面上这样做,使用局部热量使散热片和阀门变形,以分别局部适应热阻和冷却剂流速。我们的目标是将该技术从TRL 4提升到TRL 6,以吸引合作伙伴的兴趣并继续开发,以便合作伙伴将来进行许可和商业化。该项目的目标是为特定应用(数据中心冷却和电力电子冷却)定义最有前途的设备配置,证明功耗降低50%,温度不均匀性降低10°C,并评估可靠性和可操作性限制。
项目成果
期刊论文数量(0)
专著数量(0)
科研奖励数量(0)
会议论文数量(0)
专利数量(0)
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Fréchette, Luc其他文献
Fréchette, Luc的其他文献
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{{ truncateString('Fréchette, Luc', 18)}}的其他基金
Smartflex - Laminated MEMS and Microfluidics
Smartflex - 层压 MEMS 和微流体
- 批准号:
RGPIN-2018-06775 - 财政年份:2022
- 资助金额:
$ 9.11万 - 项目类别:
Discovery Grants Program - Individual
NSERC/Teledyne DALSA Industrial Research Chair in Next Generation MEMS and Microphotonics
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548603-2018 - 财政年份:2021
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Industrial Research Chairs
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Smartflex - 层压 MEMS 和微流体
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RGPIN-2018-06775 - 财政年份:2021
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$ 9.11万 - 项目类别:
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548603-2018 - 财政年份:2020
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$ 9.11万 - 项目类别:
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RGPIN-2018-06775 - 财政年份:2020
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Market assessment of self-regulated heat sink device for uniform temperature distribution
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548729-2020 - 财政年份:2019
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$ 9.11万 - 项目类别:
Idea to Innovation
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Smartflex - 层压 MEMS 和微流体
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RGPIN-2018-06775 - 财政年份:2019
- 资助金额:
$ 9.11万 - 项目类别:
Discovery Grants Program - Individual
NSERC/Teledyne DALSA Industrial Research Chair in Next Generation MEMS and Microphotonics
NSERC/Teledyne DALSA 下一代 MEMS 和微光子学工业研究主席
- 批准号:
548603-2018 - 财政年份:2019
- 资助金额:
$ 9.11万 - 项目类别:
Industrial Research Chairs
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RGPIN-2018-06775 - 财政年份:2018
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$ 9.11万 - 项目类别:
Discovery Grants Program - Individual
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532256-2018 - 财政年份:2018
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$ 9.11万 - 项目类别:
Idea to Innovation
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