Self-adaptive heat sink - I2I Phase I

为了降低冷却功耗并提高微电子和电力系统的可靠性，智能热管理变得必要，特别是考虑到热负荷随时间和不同组件的变化。为了满足这一需求，我们创造了一种新的冷却方法，可以最大限度地减少冷却剂的消耗，同时保持温度均匀，即使在时间依赖性和非均匀热负荷情况下也是如此。事实上，液冷散热器的内部几何结构能够根据当地需要调整热提取能力的分布。它在没有传感器或外部电源的大表面上工作，利用局部热量使恒温鳍和阀门变形，分别适应局部热阻和冷却剂流速。目标是将这项技术从TRL 4带到TRL 6，以吸引合作伙伴的兴趣并继续发展，以便合作伙伴在未来获得许可和商业化。该项目的目标是为特定应用（数据中心冷却和电力电子冷却）定义最有前途的设备配置，证明功耗降低50%，温度不均匀性降低10°C，并评估可靠性和可操作性限制。

To reduce the cooling power consumption and improve the reliability of microelectronics and electrical power systems, intelligent thermal management becomes necessary, especially considering that heat loads vary over time and across different components. To address this need, we have created a new approach for cooling that can minimise the coolant consumption while maintaining the temperature uniform, even under time-dependant and non-uniform heat load scenarios. Indeed, the internal geometry of a liquid-cooled heat sink is able to tailor the distribution of the heat extraction capacity to the local needs. It does so over large surfaces without sensors or external power, using the local heat to deform thermostatic fins and valves to locally adapt the thermal resistance and coolant flow rate, respectively. The goal is to bring this technology from TRL 4 to 6 to attract partner interest and pursue its development, for future licensing and commercialisation by the partner. The objectives of this project are to define the most promising device configurations for specific applications (data center cooling and power electronics cooling), demonstrate a 50% reduction in power consumption and 10°C reduction in temperature non-uniformity, and asses the reliability and operability limits.