Fast infrared sensors for advanced 3D imaging

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We will advance a new technology for time-of-flight (ToF) distance ranging that enables 3D imaging. The application of the technology is in the consumer electronics and automotive sectors - markets today totaling multi-$10Billion at the sensor level, and growing at 23%/year CAGR. There is increasing demand in consumer electronics for augmented reality and enhanced user experience; reliable face identification and biometrics for privacy and security of personal data; and, in the automotive sector, for accurate machine vision to enable safe self-driving cars. The incumbent technology relies on the emission of sub-nanosecond pulses of near-infrared (typically 850 and 940 nm) light that, once reflected from the object being imaged (the target), are detected using a silicon photodetector. The delay time between emission from the source, and return to the detector, contains information about the distance of the object. Today's technologies are limited by silicon's insensitivity to infrared light longer than 1100 nm - a spectral region where cost-effective and efficient light sources exist, and background solar radiation is minimized. The present-day alternatives to silicon, such as InGaAs, are too costly and difficult to integrate in existing readout electronic systems. Our new ToF technology employs colloidal quantum dots (QD) to realize efficient, fast, and cost-effective photodetectors operating at 1380 nm. This grant will enable the development of a prototype and the systematic comparison of its performance compared to existing / incumbent technologies. These results will be key to attract seed investment in a startup company and to establish strategic partnerships to accelerate the time to marketing of the proposed technology.