Atmospheric pressure spatial atomic layer deposition system

点击翻译按钮获取中文摘要

Thin film coatings are integral components of many technologies (all modern electronics, energy capture and storage devices, optical components, food packaging, etc.). As feature sizes continue to decrease (e.g., in integrated circuits and memory devices), better and better control over the coating thickness and properties is needed. Atomic layer deposition (ALD) is the best technique for producing films with nanometer-scale thickness control, as it deposits a film one atomic layer at a time. Weaknesses associated with ALD include its speed (it is slow) and its need for a vacuum chamber, which hinders its use in some applications (e.g., roll-to-roll manufacturing and large-area coatings). Researchers at the University of Waterloo have developed an atmospheric pressure spatial atomic layer deposition tool. The invention can deposit nanoscale coatings at low temperatures, is 1-2 orders of magnitude faster than ALD, and is capable of coating large substrates for commercial applications. These advantages make the UW invention very attractive for high-throughput manufacturing. In the proposed project, the performance of the UW invention will be benchmarked (e.g., operating cost, compliance with regulations). Preliminary testing of the coatings in promising applications (thin-film batteries, photovoltaics, antimicrobial coatings) will also be performed. The results of the planned beta trials and application testing will help establish target market vertical(s), timing of a possible startup company's creation, and a go-to-market strategy.