Atmospheric pressure spatial atomic layer deposition system

大气压空间原子层沉积系统

• 批准号: 557217-2020
• 负责人: Musselman, Kevin
• 金额: $ 9.11万
• 依托单位: University of Waterloo
• 依托单位国家: 加拿大
• 项目类别: Idea to Innovation
• 财政年份: 2020
• 资助国家: 加拿大
• 起止时间: 2020-01-01 至 2021-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=706601
• 关键词: Atmospheric; pressure; spatial; atomic; layer

Thin film coatings are integral components of many technologies (all modern electronics, energy capture and storage devices, optical components, food packaging, etc.). As feature sizes continue to decrease (e.g., in integrated circuits and memory devices), better and better control over the coating thickness and properties is needed. Atomic layer deposition (ALD) is the best technique for producing films with nanometer-scale thickness control, as it deposits a film one atomic layer at a time. Weaknesses associated with ALD include its speed (it is slow) and its need for a vacuum chamber, which hinders its use in some applications (e.g., roll-to-roll manufacturing and large-area coatings). Researchers at the University of Waterloo have developed an atmospheric pressure spatial atomic layer deposition tool. The invention can deposit nanoscale coatings at low temperatures, is 1-2 orders of magnitude faster than ALD, and is capable of coating large substrates for commercial applications. These advantages make the UW invention very attractive for high-throughput manufacturing. In the proposed project, the performance of the UW invention will be benchmarked (e.g., operating cost, compliance with regulations). Preliminary testing of the coatings in promising applications (thin-film batteries, photovoltaics, antimicrobial coatings) will also be performed. The results of the planned beta trials and application testing will help establish target market vertical(s), timing of a possible startup company's creation, and a go-to-market strategy.

薄膜涂层是许多技术（所有现代电子，能量捕获和存储设备，光学元件，食品包装等）的组成部分。随着特征尺寸的不断减小（例如，在集成电路和存储设备中），需要更好地控制涂层的厚度和性能。原子层沉积（ALD）是制备纳米级厚度薄膜的最佳技术，因为它一次沉积一个原子层。ALD的缺点包括速度慢，需要真空室，这阻碍了它在某些应用中的使用（例如，卷对卷制造和大面积涂层）。滑铁卢大学的研究人员开发了一种大气压空间原子层沉积工具。该发明可以在低温下沉积纳米级涂层，比ALD快1-2个数量级，并且能够在商业应用中涂层大型基底。这些优点使UW的发明对高通量制造非常有吸引力。在拟议的项目中，将对UW发明的性能进行基准测试（例如，运营成本，遵守法规）。还将对涂层在有前景的应用（薄膜电池、光伏、抗菌涂层）中的应用进行初步测试。计划中的beta测试和应用程序测试的结果将有助于确定目标垂直市场，确定可能成立的初创公司的时间，并制定进入市场的战略。