Connectem

康泰姆

• 批准号: 566981-2021
• 负责人: Gibbins, Tim
• 金额: $ 1.82万
• 依托单位: Conestoga College Institute of Technology & Advanced Learning
• 依托单位国家: 加拿大
• 项目类别: Applied Research and Development Grants - Level 1
• 财政年份: 2021
• 资助国家: 加拿大
• 起止时间: 2021-01-01 至 2022-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=724335
• 关键词: Connectem

Addem Labs is an electronics development platform company who have developed a proprietary film that allows for the creation of copper Printed Circuit Boards (PCBs) with nothing more than traditional unmodified printers. This self-contained film replaces multiple processes in the production chain of circuit boards and enables users to prototype hardware in a matter of minutes, as opposed to the days or weeks that are currently required to build a prototype using traditional fabrication techniques. Working with Conestoga College, Addem Labs Inc. wants to create a web-based software platform for electronics engineers and engineering students to support the import of 3D models of electronics components for design, a task which is typically performed multiple times a day by design engineers. The project focus is on the creation of a new tool that allows for existing electronics-CAD (e-CAD) software to interface with Connectem, Addem Lab's novel e-CAD solution. Connectem utilizes a custom format for electronic design files. The proposed project will involve research and development to create front end UI, data parsing, data format conversion based on the source, as well as creating testing and evaluation software for the overall system that will integrate the design and development of Printed Circuit Boards using this new process.

Addem Labs是一家电子开发平台公司，他们开发了一种专有薄膜，可以使用传统的未经修改的打印机创建铜印刷电路板（PCB）。这种独立的薄膜取代了电路板生产链中的多个过程，使用户能够在几分钟内制作硬件原型，而不是目前使用传统制造技术制作原型所需的几天或几周。与Conestoga College，Addem Labs Inc.希望为电子工程师和工程专业学生创建一个基于Web的软件平台，以支持导入用于设计的电子元件的3D模型，这是一项通常由设计工程师每天多次执行的任务。该项目的重点是创建一个新的工具，允许现有的电子CAD（e-CAD）软件与Connectem，Addem实验室的新颖的e-CAD解决方案接口。Connectem使用自定义格式的电子设计文件。拟议的项目将涉及研究和开发，以创建前端UI，数据解析，基于源的数据格式转换，以及为整个系统创建测试和评估软件，该系统将使用新工艺集成印刷电路板的设计和开发。