Materials and Processes for Improved Photonic Package Stability

提高光子封装稳定性的材料和工艺

• 批准号: 573454-2022
• 负责人: Danovitch, DavidDH
• 金额: $ 4.44万
• 依托单位: Université de Sherbrooke
• 依托单位国家: 加拿大
• 项目类别: Alliance Grants
• 财政年份: 2022
• 资助国家: 加拿大
• 起止时间: 2022-01-01 至 2023-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=754050
• 关键词: Materials; Processes; Improved; Photonic; Package

The volume of data being transmitted (streaming, blockchain, machine learning, etc.) continues to increase exponentially. To carry this data, the traditional metallic transmission systems (typically copper) are being replaced with light-based (photonic) medium to reduce both the space and power consumption. This implies integrating photonic/optical components within the microelectronics infrastructure for electrical to optical conversion and optical interconnection. A key area of focus to bring such technology to the mainstream is the connection of multiple optical fibers to the microelectronic package using a photonic integrated circuit (PIC) as the interface. To accomplish such fiber connections at high densities yet in a highly automated, cost-effective fashion, the PIC chip must be maintained extremely flat in the region of connection, yet the material sets and processes inherent to the microelectronic package are conducive to stresses that bend (warp) both the package and the chips therein, including the PIC. To address the issues of PIC chip warpage, and thereby improve the integrity of photonic packages, we propose in this project two research approaches: (1) reduce actual warpage through the use of new material sets and/or novel localized processing techniques, and (2) introduce innovative low temperature processing approaches that allow fiber attach to the PIC chips prior to the warpage inducing processes. Promising research results will be validated using industrial scale equipment and automated assembly techniques. Success in this project will enable high volume Canadian production of next generation photonic transmitters/receivers and network switches and therefore contribute to maintaining Canada's reputation as a world leader in the field of photonics.

传输的数据量（流媒体、区块链、机器学习等）持续呈指数级增长。为了传输这些数据，传统的金属传输系统（通常是铜）正在被光基（光子）介质取代，以减少空间和功耗。这意味着将光子/光学组件集成到微电子基础设施中，以实现电光转换和光学互连。将此类技术推向主流的一个关键领域是使用光子集成电路（PIC）作为接口将多条光纤连接到微电子封装。为了以高度自动化、经济高效的方式实现高密度光纤连接，PIC 芯片必须在连接区域保持极其平坦，而微电子封装固有的材料组和工艺有利于产生使封装和其中的芯片（包括 PIC）弯曲（翘曲）的应力。为了解决 PIC 芯片翘曲问题，从而提高光子封装的完整性，我们在该项目中提出了两种研究方法：（1）通过使用新材料组和/或新颖的局部处理技术来减少实际翘曲，以及（2）引入创新的低温处理方法，允许光纤在翘曲诱导过程之前附着到 PIC 芯片上。有前景的研究成果将使用工业规模设备和自动化组装技术进行验证。该项目的成功将使加拿大能够大量生产下一代光子发射器/接收器和网络交换机，从而有助于保持加拿大作为光子学领域世界领导者的声誉。