Materials and Processes for Improved Photonic Package Stability

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The volume of data being transmitted (streaming, blockchain, machine learning, etc.) continues to increase exponentially. To carry this data, the traditional metallic transmission systems (typically copper) are being replaced with light-based (photonic) medium to reduce both the space and power consumption. This implies integrating photonic/optical components within the microelectronics infrastructure for electrical to optical conversion and optical interconnection. A key area of focus to bring such technology to the mainstream is the connection of multiple optical fibers to the microelectronic package using a photonic integrated circuit (PIC) as the interface. To accomplish such fiber connections at high densities yet in a highly automated, cost-effective fashion, the PIC chip must be maintained extremely flat in the region of connection, yet the material sets and processes inherent to the microelectronic package are conducive to stresses that bend (warp) both the package and the chips therein, including the PIC. To address the issues of PIC chip warpage, and thereby improve the integrity of photonic packages, we propose in this project two research approaches: (1) reduce actual warpage through the use of new material sets and/or novel localized processing techniques, and (2) introduce innovative low temperature processing approaches that allow fiber attach to the PIC chips prior to the warpage inducing processes. Promising research results will be validated using industrial scale equipment and automated assembly techniques. Success in this project will enable high volume Canadian production of next generation photonic transmitters/receivers and network switches and therefore contribute to maintaining Canada's reputation as a world leader in the field of photonics.