Thermal Spray Deposition Technology for Production of Complex Heat Transfer Devices

用于生产复杂传热装置的热喷涂沉积技术

• 批准号: 571985-2022
• 负责人: Chandra, SanjeevSC
• 金额: $ 1.09万
• 依托单位: University of Toronto
• 依托单位国家: 加拿大
• 项目类别: Idea to Innovation
• 财政年份: 2022
• 资助国家: 加拿大
• 起止时间: 2022-01-01 至 2023-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=759549
• 关键词: Thermal; Spray; Deposition; Technology; Production

Electronic circuits dissipate most of the electrical energy they receive as heat, which must be removed. Circuit boards are mounted on metal plates that have internal passages through which water is circulated. Research into the design of flow passages has shown that heat transfer increases as the channel diameter is reduced, but this increases the pressure drop through them. Also, it is difficult to drill networks of small diameter (< 1mm) channels using conventional techniques. We have developed a new method of fabricating cooling channels in copper and aluminum plates using thermal spray techniques. Channels are milled on the surface of a metal plate in any desired pattern. Inserts in the exact shape of the channels are made using a 3D printer out of a water-soluble polymer. The inserts are placed in the channels and molten metal is sprayed on the surface of the metal plate using a twin wire-arc system. The plate is then placed in an ultrasonic water bath for several hours to dissolve the polymer inserts, leaving open the channels under the sprayed surface. The plates fabricated were found to provide significantly higher heat transfer than commercial cold plates. It was possible to machine multiple passes of the cooling channel in the same plate area, increasing the surface area wetted by the liquid. A longer flow path, and multiple bends in the channel, promoted turbulence in the flow and enhanced heat transfer. This technique can be used to make novel designs of cold plates that can be optimized for specific circuit board layouts. We can make channels on the surface of curved cooling plates, which is important for applications such as battery cooling. This Market Assessment Proposal will help identify commercial demand for this technology in making cooling systems that can be used in the computer, automotive and other industries.

电子电路将它们接收到的大部分电能以热量的形式消耗掉，这些热量必须被带走。电路板安装在金属板上，金属板有内部通道，水通过这些通道循环。对流道设计的研究表明，随着流道直径的减小，换热增加，但这会增加流道内的压降。此外，使用传统技术很难钻出小直径(1 Mm)的沟槽网络。我们开发了一种利用热喷涂技术在铜板和铝板上制造冷却通道的新方法。槽道在金属板的表面上以任何所需的图案进行铣削。通道形状的插入物是使用3D打印机从水溶性聚合物中制成的。将插件放置在通道中，并使用双丝-弧系统将熔融金属喷涂在金属板的表面上。然后将平板放在超声波水浴中几个小时，以溶解聚合物嵌件，使喷涂表面下的通道打开。制造的平板被发现提供了比商业冷板高得多的热传递。可以在同一平板区域内加工多道冷却通道，从而增加被液体润湿的表面积。较长的流动路径和通道中的多个弯道，促进了流动中的湍流和强化了换热。该技术可用于制造可针对特定电路板布局进行优化的新型冷板设计。我们可以在弯曲的散热板表面制造通道，这对于电池冷却等应用非常重要。这项市场评估提案将有助于确定这项技术在制造可用于计算机、汽车和其他行业的冷却系统方面的商业需求。